JOINT DEVELOPMENT PROJECTS

Examples of Joint Development Projects with Industry

  • Signal conditioning ASIC which will operate with a mechanical sector structure
  • Wafer-scale lateral patch
  • Wafer Level Packaging with hermeticity for DMD devices
  • Silicon nanowire biochip for nucleic acid detection
  • Silicon MEMS resonator device
  • Ultra-miniature four channel TOSA/ROSA for CWDM applications
  • Stacked Silicon die for heart pacemaker module
  • Integrated liquid cooling solutions for 3-D Silicon Stacked Modules
  • 10Gb/s transceiver SMT modules with laser diode and photodiode
  • MEMS components for bio-medical application
  • Oxide CMP processing on 200mn wafers for MEMS application
  • Feasibility study of lateral patch clamping
  • 90nm RFCMOS devices modeling and IC validation
  • RF noise characterization and modeling
  • Silicon based micromirror array
  • Silicon based optical modulator
  • Infectious viral RNA sample preparation prototype cartridge
  • Cu/ low-k flip chip packaging
  • Programmable oscillator IC
  • AuSn solder layer and solder stop for photonics assembly