INTERCONNECTS AND PACKAGING (IPP)

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A*STAR IME is home to one of the premier advanced packaging and wafer-level packaging research facilities in Asia, and the leader of packaging consortia including the well-established Electronics Packaging Research Consortium (EPRC).

The Interconnect and Packaging Programme (IPP) at IME focuses on strategic research areas in the research and development of 3DIC and TSI platform with TSV technologies, 3D stacking with C2W and W2W bonding technologies, embedded wafer level packaging, Integrated Passive Device (IPD) with Si or polymer substrate, MEMS packaging, electrical, thermal, mechanical design, materials, process and reliability.


For enquiries, please contact:
Mr. Srinivasa Rao Vempati
Tel: +65 6770 5435
E-mail: vempati@ime.a-star.edu.sg