As device scaling powered by Moore’s law faces
challenges in meeting industry requirements, advanced packaging and
interconnect technologies have emerged as a key alternative for achieving
performance, power, form-factor, and cost requirements that are critical to
industry drivers such as mobile, 5G, data
centres, automotive, and IoT. IME offers a broad range of advanced packaging
technology and manufacturing solutions to address current and future industry
requirements. Our advanced packaging platforms include 2.5D through-silicon
interposer, 3D TSV, fan-out wafer level packaging, MEMS wafer level chip-scale
packaging, fine-pitch Cu pillar, Chip-to-Wafer/Wafer-to-Wafer hybrid bonding,
electronic-photonic integration, intelligent power module, and thermal
solutions. IME works closes with the entire semiconductor supply chain
including fabless, foundry, OSAT, Equipment, Materials and EDA partners to
ensure our technology solutions are manufacturing ready.
IME’s integrated circuits and AI hardware development team is supported by a strong team of established researchers. The team has amassed an extensive portfolio of IP building blocks, including computing hardware, ultra-low-power sensor node processor (SNP), power management integrated circuit (PMIC), sensor readout IC, radio transceivers, hardware securities and system-on-chip design. These capabilities are designed to support next-generation innovative devices and systems, such as miniaturization, integrated power management, energy efficiency and wireless connectivity for AI-enabled Internet-of-Things (IoT). These capabilities serve the development of hardware AI applications such as autonomous vehicles, machine health monitoring, environment sensing, surveillance, vital signs monitoring, and data computing. Neuromorphic computing and Deep learning are the two latest development that team is focusing on. These AI technology platform represent the two main memory-centric computing architectures: (1) neuro-based SNN analog approach and (2) the deep learning-based digital approach which uses CNN or RNN.
SENSORS, ACTUATORS & MICROSYSTEMS
The Sensors, Actuators, & Microsystems team focuses on developing novel transducers at the heart of many electronic systems today, bridging the electronic and the real world. Semiconductor microfabrication techniques are leveraged for engineering high performance, microscale devices that can be batch fabricated at low-cost. Some of the key themes in the group are: acoustic sensors, piezoelectrics, as well as gas and chemical sensors.
Advanced Optics Program (AOP), with deep roots in Si photonics, focuses at developing technology platforms for the production of metasurface based flat optic components and systems using existing infrastructure at advanced CMOS foundries. Most of the metasurface-based flat optic components demonstrated worldwide are patterned using EBL, which is known to be great for high resolution patterning but not suitable for mass-manufacturing due to extremely low throughput. AOP team at IME is using Nikon 193 nm immersion scanner to pattern metasurface. Within a short period, team has established full capability of design, fabrication and characterization of various flat optic components – metalens, color filters, band-pass filters, waveplates, dot projectors – on 12” Si/glass wafers.
The goal of Medtech Programme is to collaborate closely with clinicians, cross-disciplinary research institutes and medical industry partners to address and develop technical solution for unmet clinical needs. IME Medtech Programme design, fabricate, bio-package and characterize highly sensitive Micro-electro-mechanical system (MEMS) sensors that can measure various physiological parameters in the human body. Such sensors when combined with Application-Specific-Integrated-Circuits (ASIC) and wireless interface circuits result in highly integrated devices for the medical / healthcare industries.