27 April 2014

IME researchers have won Best Paper Award for their paper published in the Electronics Manufacturing category of the IEEE Transactions on Components and Packaging Technologies in 2013.

Titled “3D numerical and experimental investigations on compression molding in multichip embedded wafer level packaging”, the paper describes key findings that will allow improved detection and trouble-shooting of molding defects to enable higher manufacturing throughput.

Mr Chai Tai Chong and Dr Zhang Xiaowu from IME’s Interconnects and Packaging (IPP) Program were invited to receive the award at the 64th Electronics Components and Technology Conference 2014 which was held in Florida, USA from 27 - 30 May 2014.