12 December 2014
IME won the Best Poster Paper Award at the 16th EPTC. The award recognizes impactful research findings that will lead to new developments in packaging technologies.
The paper, titled “Study on dynamic modeling and reliability analysis of wafer thinning process for through-silicon via (TSV) wafer” by Dr Che Faxing and team, describes key findings that provide insight into wafer stress caused by TSV wafer thinning process using the dynamic finite element analysis (FEA) modeling method. The results can be used for the optimization of TSV wafer thinning process by reducing wafer stress.
Dr Che Faxing (left), IME’s Scientist, received the award on behalf of the IME team from Mr Alfred Yeo, General Chair of EPTC2014 conference at Marina Bay Sands, Singapore.