4 June 2012
Peng Lan, a former Ph.D. student at IME, has received the Best Student Paper Award for his presentation at the 2012 International Interconnect Technology Conference held in USA. His winning paper “Ultrafine pitch (6-um) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking” describes a new method that would pave way to realise future 3-D integrated circuits (ICs) and systems. Peng Lan was doing his Electrical and Electronic Engineering Ph.D. at the Nanyang Technological University (NTU), Singapore. His mentors were Dr. Patrick Lo and Dr. Li Hong Yu, IME, and Prof. Tan Chuan Seng, NTU.