28 May 2013
IME’s published article in the IEEE Transactions on Components, Packaging and Manufacturing Technology has received the Best Paper Award 2012 in the Advanced Packaging category. The paper titled “Compact High-Gain mmWave Antenna for TSV-Based System-in-Package Application” by Sanming Hu and co-workers was awarded at the upcoming 63rd Electronic Components and Technology Conference (ECTC) in Las Vegas, USA.
Five papers were selected for Best Paper Awards from among 240 published in the IEEE Transactions on Components, Packaging and Manufacturing Technology journal in 2012. The articles were appraised on the criteria of originality of concept, skill in analysis, importance and timeliness of the subject, organization and lucidity of presentation.
The award-winning paper describes a compact on-chip antenna for high speed millimetre-wave communication applications. The antenna demonstrated 30 times stronger signal transmission over on-chip antennas at 135 GHz. At just 1.6mm x 1.2mm, it is the smallest silicon-based cavity-backed slot (CBS) antenna reported to date for ready integration with active circuits.