16 July 2013

Dr Gilho Hwang, a researcher at the A*STAR Institute of Microelectronics, has received the Best Paper Award at the 7th International Conference on Materials for Advanced Technologies (ICMAT) held at Suntec Convention Centre Singapore from 30 June – 5 July 2013. The poster titled “Development of copper through silicon via (TSV) electroplating process with low overburden” describes a cost-saving process that reduces chemical-mechanical planarization (CMP) time and lowers the occurrence of wafer warpage.