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Integrated Circuits

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Advanced Optics

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Sensors and Actuators

 Country Patent Number Title Grant Date
 SG  128064  Microfabricated System for Magnetic Field Generation and Focusing
 31 Jan 2008
 US  779440
 Microfabricated System for Magnetic Field Generation and Focusing
 7 Sep 2010
 SG  179006  Wafer Level Package and A Method of Forming a Wafer Level Package
 28 Mar 2013
 US  8729695  Wafer Level Package and A Method of Forming a Wafer Level Package  20 May 2014
 SG  185451  Bonding Stress Testing Arrangement and Method of Determining Stress
 15 Nov 2013
 US  9506823  Bonding Stress Testing Arrangement and Method of Determining Stress
 29 Nov 2016
 US  8603917  Method of Processing a Wafer
 10 Dec 2013
 SG  180146  Method of Processing a Wafer
 10 Jul 2014
 US  9431315  Chemical Sensor Package for Highly Pressured Environment
 30 Aug 2016
 US  9841399  Chemical Sensor Package for Highly Pressured Environment
 12 Dec 2017
 US  9613928  Method and Apparatus for Chip-to-Wafer Integration
 4 Apr 2017
 SG  11201600268Y  Method and Apparatus for Chip-to-Wafer Integration
 17 Apr 2018
 JP  6353373  Joint Apparatus, Joint System, and Joint Method
 15 Jun 2018
 JP  6353374  Joint Apparatus, Joint System, and Joint Method
 15 Jun 2018