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Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics
IME researchers have described an in-depth study to evaluate the performance of two different Au-based eutectic solder alloys for high-temperature applications. After subjecting the alloys to thermal aging at 300
C for 500 hours, the mechanical properties, as well as the interfacial reactions between the bulk solders and common under-bump metallization materials were investigated. Characterisation results show that Au-Ge is superior to Au-Si for high temperature electronics applications as only the former meets the requirement of the oil and gas industry. This study is critical to realise high temperature electronics that perform reliably under high temperature operating environments.
Chidambaram Vivek et. al., “Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics," Journal of Electronic Materials, Published online 10 May 2012.
Copyright A*STAR Institute of Microelectronics 2019