IME has the capabilities and cutting edge facilities to conduct advanced research and development in microelectronics technology. The material, device and reliability analysis team provides materials and process characterization, failure analysis and reliability testing to support our industry partners engaged in wafer fabrication, packaging, assembly and test.
Performs various industry test standards to discover potential failures in design and ultimately provide a confidence level that meet its required reliability requirement.
• High temperature storage
• Thermal cycling
• Thermal shock (liquid to liquid/air to air)
• Temperature humidity bias
• Highly accelerated stress test
• Pressure cooker test
• Hermeticity (fine leak test)