IME has the capabilities and cutting edge facilities to conduct advanced research and development in microelectronics technology. The material, device and reliability analysis team provides materials and process characterization, failure analysis and reliability testing to support our industry partners engaged in wafer fabrication, packaging, assembly and test.

Structure and Composition Characterisation Reliability and Test Electrical Test
Chemical, structural and defect analysis at nanometer and sub-nanometer scale transmission Electron Microscopy (TEM) / Energy Dispersive Scan (EDS)/Electron Energy Loss Spectroscopy (EELS)

• Monochromated Scanning TEM (MSTEM)
• Focus Ion Beam (FIB)
• Scanning Electron Microscope (SEM) /
Energy Dispersive X-ray (EDX)
• Sample preparation

Surface, sub-surface and interface characterisation; composition roughness, etc.

• Auger Electron Spectroscopy (AES)
• Atomic Force Microscopy (AFM)

Construction analysis of devices and packages
• X-ray imaging
• Scanning Acoustic Microscopy (SAM)

Performs various industry test standards to discover potential failures in design and ultimately provide a confidence level that meet its required reliability requirement.

• High temperature storage
• Thermal cycling
• Thermal shock (liquid to liquid/air to air)
• Temperature humidity bias
• Highly accelerated stress test
• Pressure cooker test
• Hermeticity (fine leak test)


Package level failure analysis
Human Body Model (HBM) and Machine Model (MM) electrostatistics discharge for integrated circuits devices (ESD tester)

Semiconductor devices DC parameter characterisation

• 200mm and 300mm probe stations with DC parametric Analyzer and LCR Meters