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 300mm Silicon-based TSV Fab process modules

Stepper Coater Track
Lithography

• Stepper
• CDSEM

ECP Tool Set
PVD/ECP
• PVD Charger
• TSV Cu Plating
• RDL
• Damascene

Wets/Etch
• Plasma Stripper
• Metal Spray
• TSV Clean

Annealing Curing
Furnaces
• Thermal Anneal
• Passivation

PVD Charger 300mm/200mm and Wafer Backgrinder
PAT
• Backgrinder
• Flip Chip Bonder
300mm Silicon-based TSV FAB in-line Metrology

Defect Review SEM


Surf Scan SP2
In-Line Metrology
• Defect Review SEM
• TSV Metrology
• Cu Profiler
• Sheet Resistance
• Defect Inspection (un-patterned,SP2)
• Film Thickness Measure.
• Stress Measurement
• Microscope (Auto)
• Wafer Sorter

TSV Metrology ET Prober
Electrical Testing
• Probe Station (auto)


Advanced Photo
• 193nm Dry Scanner
• Track for Scanner
• Overlay
200mm Silicon-based Wafer Processing (Micro and Nano Electronics)

• Diffusion / LPCVD furnaces
• SiGe epitaxy (UHVCVD)
• ALCVD for high k / metal gate & interconnects barrier
• Ion implanter
• Wafer Cleaning
• RTA for S/D spike and metal/silicide
• Metallization
      • Metal PVD for Gate / Barrier / Silicide
      • PVD for barrier and Cu - interconnects
      • Cu electroplating for interconnects
• Lithography (248 nm DUV)
• Dielectric (low-K) Deposition
• Plasma etch for poly-Si, dielectric,metal
• CMP for oxide, W, and Cu
• In-line metrology/Analysis
200mm Silicon-based Wafer Processing (MEMS and Post CMOS)

MEMS Stepper Backgrinder

Bonder 4-Chamber Cluster DRIE Tool

• MEMS stepper & double sided Aligner
• Wafer bonder (High Pr./Anodic/Fusion/Frit)
• Metal PVD- Moly, AlN cluster tool
• Plasma cluster DRIE (Si/Diele/Metal/PRS)
• Wet TMAH/KOH etching
• Electroplating for Cu, Ni, Au,
• Wafer thinning & polishing