| Date |
Headlines |
| 11 February 2021 | A*STAR’s Institute of Microelectronics Partners Eight Semiconductor Companies In Chip-To-Wafer Hybrid Bonding Consortium
|
| 28 October 2020 | STMicroelectronics Establishes World’s First “Lab-in-Fab” to Advance Adoption of Piezoelectric MEMS in Singapore in Partnership with ASTAR and ULVAC |
| 7 October 2019 |
A*STAR's Novel AI Chip Design platform to give the semiconductor industry a boost in productivity and quality |
| 18 September 2019 |
A*STAR, arQana Technologies to Jointly Develop mmWave Phased Array System for the 5G Cellular Market
|
| 26 March 2019 |
A*STAR and Soitec Launch Joint Program to Develop a New Layer Transfer Process for Advanced Packaging |
| 3 December 2018 |
A*STAR, One Biomed launch S$9M Joint Lab to make diagnostic kit for infectious diseases |
| 8 November 2017
|
A*STAR IME's New Multi-Chip Fan-Out Wafer Level Packaging Development Line to drive Innovation and Growth in Semiconductor Industry |
| 13 June 2017 |
ROHM and A*STAR's IME to Develop Artificial Intelligence Chip for Predictive Maintenance in Smart Factories |
| 19 September 2016 |
Applied Materials and A*STAR's Institute of Microelectronics to Advance R&D in Fan-Out Wafer Level Packaging
|
| 26 July 2016
|
A*STAR's IME Kicks Off Consortia to Develop Advanced Packaging Solutions for Next-Generation Internet of Things Applications and High-Performance Wireless Data Transfer Technologies |
| 30 June 2016 |
A*STAR's IME Launches Chip-on-Wafer Consortium II and Cost-Effective Interposer Consortium to Advance Chip Packaging Solutions for High-Volume Manufacturing |
| 8 June 2016 |
A*STAR IME's Consortium to Deepen Capabilities in MEMS Technologies for Industrial Internet of Things, Automotive, and Indoor Navigation Applications |
| 13 January 2016 |
New Wireless Implantable Device from A*STAR's IME and Biospark to Improve Chronic Pain Management |
| 19 October 2015 |
Applied Materials and A*STAR Announce New R&D Joint Lab in Singapore for Advanced Semiconductor Technology |
| 23 September 2015 |
A*STAR's IME and Lumerical Solutions Develop a Calibrated Compact Model Library for IME's Silicon Photonics Platform and Process Design Kit |
| 4 August 2015 |
A*STAR's IME Consortium Develops Advanced Packaging Solutions for Higher Performance and Efficiency in Consumer and High Power Electronics |
| 18 June 2015 |
A*STAR's IME and INEX Innovations Exchange to Develop Non-Invasive Prenatal Diagnostic Technology |
| 15 April 2015 |
A*STAR's IME and Industry Partners to Enable High Density / Low Cost Packaging Technology for System Scaling within Smart Device
|