| Title of Publication |
Author(s) |
Name of Journal / Conference |
| Stealth Dicing Challenges for MEMS Wafer Application |
Daniel Ismael Cereno, Sunil Wickramanayaka |
Electronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.132 |
Development of TSV electroplating process for
via-last technology |
Hwang Gilho, Ravanethran Kalaiselvan |
Electronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.219 |
| Forming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging (FOWLP) |
Leong Yew Wing, Hsiao Hsiang-Yao, David Soon Wee Ho, Lau Boon Long, Lin Huamao |
Electronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.342 |
| Study of C2W Bonding Using Cu Pillar with Side-wall Plated Solder |
Xie Ling, Sunil Wickramanayaka, Vasarla Nagendra Sekhar and Daniel Ismael Cereno |
Electronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.260 |
| Study of line-space pitch multiplication using graphoepitaxy directed self-assembly for semiconductor applications |
Wang Shi Jie, Deng Wei, Seow Yong Ann, Chen Bing, Lin Qun Ying |
Journal Of Electronic Materials, Vol. 46, No. 7, 2017, DOI: 10.1007/s11664-017-5431-y,2017 The Minerals, Metals & Materials Society |
| MEMS industry-worth etching to fabricate tapered structures in SiO2 |
Vladimir Bliznestsov, Li Bin, Lee Jae-Wung and Lin Huamao |
Journal of Microelectromechanical System (JMS), Publish 04 Oct 2017, DOI#10.1109/JMEMS.2017.2755046 |
| 6um Pitch High Density Cu-Cu bonding for 3D IC Stacking |
Xie Ling, Sunil Wickramanayaka, Chong Ser Choong, Vasarla Nagendra Sekhar, Daniel Ismael, Ye Yong Liang |
66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.141) |
| High-throughput Thermal Compression Bonding of 20 um Pitch Cu Pillar with Gas Pressure Bonder for 3D IC Stacking |
Xie Ling, Sunil Wickramanayaka, Chong Ser Choong, Vasarla Nagendra Sekhar, Daniel Ismael Cereno |
66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.343) |
| Al-Ge Diffusion Bonding for Hermetic Sealing Application |
Vivek Chidambaram, Sunil Wickramanayaka |
Journal of ELECTRONIC MATERIALS, Vol. 44, No. 7, Pages 2387-2395, Published 6-Mar-15, DOI: 10.1007/s11664-015-3683-y |
| Deep SiO2 etching with Al and AlN masks for MEMS devices |
Vladimir Bliznetsov, Hua Mao Lin,Yue Jia Zhang and David Johnson (SPTS) |
Journal of Micromechanics and Microengineering (JMM), 25 (2015) 087002 (8pp), Published Jul 2015, DOI#10.1088/0960-1317/25/8/087002 |