Events

Seminar on Green Packaging: A Gateway to Sustainability

Date: 13 Jul 2011 - 13 Jul 2011

Venue: SIMTech Auditorium, Tower Block, Level 3

Introduction

How is the packaging industry responding to climate change and resource depletion? With due consideration of these environmental issues,  key industry experts in this seminar will address the hottest topics. The seminar aims to infuse the audience with the latest trends in Green Packaging, update legislation affecting designers and manufacturers, the application of simulation for a greener and sustainable package as well as innovative technologies for greener and more sustainable packaging which include energy efficiency, recyclable and biodegradable materials, reusability etc. Case studies from different companies of innovative packaging solutions that are sustainable, green and cost effective will be presented.Through this event, participants will gain a wide range of industry knowledge conducive to a more productive and profitable operation.  This seminar is co-organised by Singapore Polytechnic - DMLS; Singapore Polytechnic - Food and Innovation Research Centre, Plastics Rubber Institute Singapore (PRIS), Packaging Agreement and supported by Winrigo (S) Pte Ltd.  
For a copy of the PDF version, please click here.

Programme

8.30am

Registration

9.00am

Welcome Address by SIMTech

9.10am

 

Packaging and Sustainability – No Contradiction for Bosch Packaging Technology
Mr Christian Treitel, Director Service Leader Unit South East Asia, Packaging Technology, Customer Service, Robert Bosch Limited

9.30am

Sustainable Design Shapes the Future of Green Packaging
Mr Yves Soppelsa, Leader, Sustainable Platform, Packaging & Design, Nestlé

9.50am

Tea Break

10.10am

 

The Application of Realistic Simulation in Reducing Material Usage and Waste for Green Packaging
Mr Clive Ford, Manager of the Advanced Analysis Consultancy Group, WorleyParsons

10.30am

 

Impact of REACH and Packaging Directive 94/62/EC on Packaging Industry
Mr Palanisamy Shanmuga Sundaram, Industry Service & Certified REACH Compliance Manager, TUV Rheinland (India) Pvt. Ltd

10.50am

Food Shelf-life versus Eco Multi-layer Barrier Packaging
Mr Teri Teo, Founder, Winrigo (S) Pte Ltd

11.10am

Green Packaging Technology Capabilities at SIMTech and Introduction of Green Packaging Consortium
Dr Zhao Jianhong, Senior Scientist, SIMTech

11.30am

Q & A

11.50am

End of Event

Abstracts 
1. Packaging and Sustainability – No contradiction for Bosch Packaging Technology 
Packaging and Sustainability are often seen as contradictory but they actually complement. More Packaging and not only less packaging can help the poor and feed the growing population in the world. In the developed economies, we can avoid packaging waste - we need to start looking at our behaviour. The right packaging can reduce the levels of energy and water consumption - not only for packaging but also in food processing and in the supply chain. Food packaging players are constantly looking for different ways to minimise the use of packaging materials - with packaging styles and new technologies. Bosch Packaging Technology is active in several ways to promote sustainable packaging within the industry and with various partners.

 

 

2.Sustainable Design Shapes the Future of Green Packaging
Design is everywhere you look, including food packaging. Every single item you buy has probably been through a design process. So how is a designer’s role evolving as our world-view expands to consider some very big question about the fate of the planet? The collection of work and case studies portrayed in this presentation give a hued overview of the opportunities, challenges and many different approaches which seem to be a dilemma with hope, action and courage to design for changes towards green and sustainability.  

 

3.  The Application of Realistic Simulation in Reducing Material Usage and Waste for Green Packaging
The principle of Reduce, Reuse and Recycle in the use of products in our daily lives is well understood, but at an industrial scale good engineering tools are needed to ensure that the concepts are viable. With the example of a number of impressive applications, from various manufacturers and end users, this presentation will look at how realistic simulation is being used to advance the development of improved packaging. Simulation today allows packaging designs to be optimised for material usage, by exploring the design envelope and identifying the best solution, without compromising functional specifications.  Manufacturers can also rapidly examine the use of materials that have a lower environmental impact, but potentially inferior properties. For instance, recycled materials can be considered, which may be weaker than the original material, but modifications to the design will maintain the performance of the product. In other cases more robust packaging, which is reused many times may be a solution. Simulation can be used to predict the durability of such systems and increase its durability. Finally, out of the box product and manufacturing solutions can be developed and tested virtually at the concept stage, allowing innovation at lower risk.

 

4. Impact of REACH and Packaging Directive 94/62/EC on Packaging Industry 
The aim of achieving a single market for packaged products and for the free movement of goods in a global marketplace is frequently threatened by packaging regulations which restrict or prevent market access. The issue for industry and trade is to ensure that any measures adopted will properly meet both the environmental and economic needs of all stakeholders. Many issues involving interpretation, implementation, monitoring results and compliance continuously arise to the present day despite the adoption of several packaging directives. In this presentation, issues arising from packaging legislation will be identified and information and opinions about them will be provided and discussed. 

 

5. Food Shelf-Life versus Eco Multi-Layer Barrier Packaging
Food packaging technologies are advancing over the years. Whilst contemplating the concept of sustainability in packaging, the entire dynamic interaction between the food shelf-life and the preservation of food flavors and freshness, multi-layer packaging has to be considered. This would call for innovative packaging with good barrier properties that can prevent contamination or spoilage caused by oxygen and other gases. An overview on the various types of packaging suited for the food and beverage industries will be shared during this presentation. More importantly, innovative solutions through engineering materials to meet the expectations of reducing or recycling in packaging applications will be shared.  

 

6. Green Packaging Technology Capabilities at SIMTech and Introduction of Green Packaging Consortium
Demand on green packaging has increased rapidly in recent years due to concerns on increasing amount of petroleum-based, non-degradable packaging materials that are being used over the world. Green packaging covers a wide concept and may include any advancement and development which can result in improved sustainability. Efforts and support are needed from product owners, consumers, packaging material suppliers and manufacturers. To promote green packaging and address challenges faced in green packaging applications, the Singapore Institute of Manufacturing Technology (SIMTech) is spearheading a consortium to facilitate industry players to participate in green packaging applications. In this presentation, green packaging related activities and capabilities in SIMTech will be introduced, and the plan for the proposed consortium will be discussed.  
 

About the Speakers

Mr Christian Treitel graduated from Westfaelische Wilhelms-Universitaet Muenster, in 1993 with a degree

in Business Administration. He is a specialist in distribution & retailing and joined Bosch in 1995 where he held

various positions. Currently, he is the Director of the Service Leader Unit South East Asia and responsible for

sales coordination and after sales service in the region for Bosch Packaging Technology, the world larges

t supplier of packaging technology with core competences of packaging of liquid pharmaceutical products,

complex, customised systems, form, fill, and seal technology, excellent service, and a strong international

presence. 

 

 

 

Mr Yves Soppelsa is currently the leader of the Sustainable Packaging Platform at Nestlé R&D Singapore Centre. He has over 10 years of professional experience related to food and beverage packaging. Previously, he worked at Nestlé as a Corporate Packaging Senior Engineer for 3 years and at Hennessy (LVMH) as Chef de project nouveaux produits for 6 years.

Mr Clive Ford is the Manager of the Advanced Analysis Consultancy group in Singapore, which is part of the international Professional Services Company - WorleyParsons. Clive joined WorleyParsons in 2002 and has been delighted to see and participate in the considerable growth in simulation use in and the region over this time. Prior to joining WorleyParsons, Clive worked in a variety of engineering roles at Corus Group in the . Clive holds a Bachelor of Mechanical Engineering from the University of Sheffield and a Masters in IT from the University of Nottingham . He is a member of the local branch committee for the Institution of Mechanical Engineers in and is active in promoting engineering simulation as an exciting career as well as its benefits to industry.

Mr Palanisamy Shanmuga Sundaram is currently working at TUV Rheinland, Bangalore as Manager for Industry Services. He is a certified REACH Compliance Manager as per Regulation EC.No.1907/2006, and also a Certified Lead Auditor for ISO 9001 Certified internal Auditor as per ISO 17025.
He has more than 14 years of manufacturing and industrial R&D experience and is currently pursuing his PhD studies in Corrosion Inhibitors.

Mr Teri Teo is the founder of Winrigo. He was invited as guest speaker for 1st Bio-plastics Asia 2009, and Manufacturing Excellence Community 2009
and Eco-Design 2009. He has been recently awarded the spirit of entrepreneurs 2010 and OCBC emerging enterprise finalist 2011.

 

Dr Zhao Jianhong is a Senior Scientist in the Singapore Institute of Manufacturing Technology (SIMTech). He obtained his PhD from the Loughborough University UK in polymer materials engineering. He has over 20 years’ experiences in polymer materials, processing engineering, and applications. He is currently the President of the Plastics and Rubber Institute of Singapore. His research interests include polymer precision and micro moulding, biopolymer development, and polymer composites processing and applications.

Who Should Attend
R&D Managers and engineers from MNCs and SMEs, University and polytechnic lecturers and students.

Registration 
This is a non-chargeable seminar and pre-registration is required. Seats are available on a first-come, first-served basis. To reserve a place, please register online.

Contact Us
For technical enquiries, Dr Cynthia Lim, Scientist, Email: shlim@SIMTech.a-star.edu.sg; Tel: 6793 8331
For general enquiries: Alice Koh, Email: kohth@scei.a-star.edu.sg; Tel: 6793 8249