Events

Advanced Substrates for High Performance Applications : Design, material Selection and Processes

Date: 20 Nov 2003 - 21 Nov 2003

Venue: Seminar Room, Valley Block, SIMTech, 71 Nanyang Drive

Course Outline :

Day One: Trends, High-Speed Design and Material Selection

0930 Industry Trends and Enabling Technologies by Dr Albert Lu
· Next-Generation Applications
· Emerging Substrate Technology
· Material Selection
· Key Challenges for High-Speed Design
· Design for Manufacturing
· Signal Integrity Concepts
· High-Speed Meaurement Concepts

1030 Substrate Design (Part 1) by Lai Lai Wai and Jin Lin
· Key Design Flow
· Electromagnetic Modelling
· Case Studies

1230 LUNCH

1330 Substrate Design (Part 2) by Lai Lai Wai and Jin Lin
· System-Level Simulation Techniques
· Case Studies

1500 TEA BREAK

1530 High-Speed Characterization by Fan Wei
· Time Domain Reflectometry
· Network Analysis
· Lab Demonstration

Day Two: Substrate Processes and Thermal Considerations

0930 LTCC Substrate Manufacturing by Chua Kai Meng
· Key Applications
· Process Flow
· Performance Characterization
· Lab Demonstration

1230 LUNCH

1330 Organic Substrate Manufacturing by Lok Boon Keng
· Key Applications
· Process Flow
· Performance Characterization
· Lab Demonstration


1500 TEA BREAK

1530 Thermal Considerations by Peter Shi
· Material Selection
· Thermal Performance
· Thermal Characterization


Course Leaders :

Dr Albert Lu, Wai Lai Lai, Jin Lin, Fan Wei, Chua Kai Meng, Lok Boon Keng and Peter Shi are from the Joining Technology Group.