Research Projects

A*STAR Flagship Programme on LTCC Technology

Emerging electronics and microsystem applications are rapidly driving the need for high-density interconnection, improved reliability, enhanced thermal management and high-frequency performance. Conventional circuit board solutions do not meet these emerging requirements. Recognising the industry needs for advanced substrate technologies, SIMTech has been actively involved in the research and development of Low Temperature Co-fired Ceramic (LTCC) technology since 2002. 

As part of the Exploit Technologies Flagship Programme initiated to accelerate the industry adoption of emerging technologies, the group launched the LTCC Boutique Foundry. For the first time, industry can leverage on our core competencies in substrate design, process development, performance validation and reliability testing. By providing a one-stop solution, the group will bridge the technology gap from the design to small volume manufacturing. Since 2002, the group has been collaborating with industry partners in the development of highly customised products in rapidly growing market sectors including wireless communications, medical devices and solid state lighting.

Solution

LTCC technology provides an excellent multi-functional integration platform. Unlike conventional circuit board technology, LTCC-based substrate technology provides robustness in harsh environment conditions whilst providing capabilities in:

  • Integration of passive and active devices
  • Hermetic sealing
  • 3D interconnection
  • Good compatibility with wide bandgap semiconductor devices
  • Integrated thermal management
  • Integrated antennas
Benefits

1st LTCC Foundry in Singapore (established in 2003)

  • Technology Differentiation
  • 50mm line / space
  • Double-sided cavities
  • Composite dielectric integration
Applications

LTCC-based substrate technology has wide applications that include:

  • High-Speed Digital Electronics
  • Wireless Communications
  • Medical Electronics
  • Harsh Environment Sensors
  • Microsystems
  • Solid State Lighting

Problems Addressed

Harsh environment sensors and intelligent monitoring / communication systems in high-temperature electronics are increasingly being adopted in aircraft and other applications. This calls for advanced substrate and interconnection technologies, as conventional circuit board technology does not meet the increasingly demanding requirements. The complexity of harsh environment electronic and sensor systems will increase rapidly. There will also be growing deployment of wide bandgap semiconductor devices, particularly in smart sensors.