Researcher Portfolio

Yu Suzhu (Dr)
Scientist II
Forming Technology
Introduction:Research Associate in school of EEE, NTU, Singapore 

Research Fellow in Tsinghua Unisplendor Group, Tsinghua University, P. R. China. 

Assistant Professor in Tianjin Science and Technological University, P. R. China.

Research Interest:Development and process study of polymers/polymer blends/composites/nanocomposites; Material formulations and characterization; Fabrication of thin films through sol-gel and template technology.
BioNotes:Ph.D, Nanyang Technological University, Singapore 
MEng, Tianjin University, P. R. China 
BEng, Tianjin University, P. R. China
Publications:1. Suzhu Yu, T. K. S. Wong, X. Hu and J. Wei, A Study on Cu Diffusion to Sol-Gel Derived Low-k Films, Microelectronics Engineering, 77, 14-20 (2005). 

2. Suzhu Yu, T. K. S. Wong, X. Hu, J. Wei and M. S. Yong, Structural, Electrical and Mechanical Properties of Templated Silsesquioxane Porous Films, Microelectronics Engineering, 77, 125-131 (2005). 

3. Suzhu Yu, T. K. S. Wong, X. Hu and M. S. Yong, Dielectric and Mechanical Properties of Surface Modified Organosilicate Films, Journal of Sol-Gel Science and Technology, 35 (1), 69-75 (2005). 

4. Suzhu Yu, S. Liu, J. Zhao, Y. K. Juay and M. S. Yong, Study of Rheological Properties of Polypropylene/Organolclay Hybrid Materials, 3rd International Conference on Materials for Advanced Technology (ICMAT), July 04-15, 2005, Singapore. 

5. Suzhu Yu, T. K. S. Wong, X. Hu and K. Pita, Synthesis and Characterization of Porous Silsesquioxane Dielectric Films, Thin Solid Films, 473, 191-195 (2005). 

6. Suzhu Yu, T. K. S. Wong, X. Hu and T. K. Goh, Effect of Processing Temperature on the Properties of Sol-Gel Derived Mesoporous Silica Films, Thin Solid Films, 462-463, 306-310 (2004). 

7. Suzhu Yu, T. K. S. Wong, X. Hu and K. Pita, Sol-Gel Derived Mesoporous Silica Films Used as Low Dielectric Constant Materials, Thin Solid Films, 462-463, 311-315 (2004). 

8. Suzhu Yu, T. K. S. Wong, X. Hu and K. Pita, Structural and Dielectric Properties of Mesoporous Silsesquioxane Films, Chemical Physics Letters, 384, 63-67, (2004).

9. Suzhu Yu, T. K. S. Wong, X. Hu, K. Pita and V. Ligatchev, Synthesis and Characterization of Templating Low Dielectric Constant Organosilicate Films, Journal of the Electrochemical Society, 151(5), F123-F127 (2004). 

10. Suzhu Yu, T. K. S. Wong, X. Hu and K. Pita, The Compasrison of Thermal and Dielectric Properties of Silsesquioxane Films Cured in Nitrogen and in Air, Chemical Physics Letters, 380, 111-116 (2003). 

11. Suzhu Yu, T. K. S. Wong and X. Hu, Low Dielectric Constant Organosilicate Films Prepared by Sol-Gel and Templating Methods, Journal of Sol-Gel Science and Technology, 29, 57-62 (2004). 

12. Suzhu Yu, T. K. S. Wong, X. Hu and K. Pita, The Effect of TEOS/MTES Ratio on the Structural and Dielectric Properties of Porous Silica Film, Journal of the Electrochemical Society, 150, F116-F121 (2003). 

13. Suzhu Yu, T. K. S. Wong, K. Pita, X. Hu and V. Ligatchev, Surface Modified Silica Mesoporous Films as an Intermetal Dielectric, Journal of Applied Physics, 92, 3338-3344 (2002) 

14. Suzhu Yu, T. K. S. Wong, K. Pita and X. Hu, Synthesis of Low Dielectric Constant Silica Mesoporous Films as an Intermetal Dielectric, Journal of Vacuum Science and Technology B, 20 (5), 2036-2042, (2002). 

15. Suzhu Yu, P. Hing and X. Hu, Thermal Conductivity of Polystyrene-Aluminum Nitride Composite, composites part A: Applied Science and Manufacturing, 33 (2), 289-292 (2002). 

16. Suzhu Yu, P. Hing and X. Hu, Dielectric Properties of Polystyrene-Aluminum-Nitride Composite, Journal of Applied Physics, 88 (1), 398-404 (2000). 

17. Suzhu Yu, P. Hing and X. Hu, Thermal Expansion Behaviour of Polystyrene-Aluminum Nitride Composite, Journal of Physics D: Applied Physics, 33 (13), 1606-1610 (2000). 

18. Suzhu Yu and P. Hing, Dynamic Mechanical Properties of Polystyrene-Aluminum Nitride Composite, Journal of Applied Polymer Science, 78 (7), 1348-1353 (2000).