Researcher Portfolio

Wang Zhenfeng (Dr)
Senior Scientist I
67938596
Microfluidics Manufacturing
Introduction:Dr. Wang Zhenfeng joined Singapore Institute of Manufacturing Technology (SIMTech) in 1998 as a Research Fellow. He has published more than 100 papers on international journals and conference.
Research Interest:His research interests include the development of various microfluidic devices and the integration technology for lab-on-chip systems.
BioNotes:Dr. WANG Zhenfeng received his Bachelor, Master and PhD degrees in electrical engineering from Tsinghua University, China
Publications:

Journal Paper

  1. H. M. Xia, Z. P Wang, W. Fan, A. Wijaya, W. Wang, Z. F. Wang, "Converting steady laminar flow to oscillatory flow through a hydroelasticity approach at microscales", Lab on a Chip, Vol. 12, pp. 60-64, 2012.
  2. Z. K. Wang, H. Y. Zheng, R. Y. H. Lim, Z. F. Wang, Y. C. Lam, "Improving surface smoothness of laser-fabricated microchannels for microfluidic application", Journal of Micromechanics and Microengineering, Vol. 21, pp 095008, 2011.
  3. L. P. Yeo, S. H. Ng, Z. F. Wang, H. M. Xia, Z. P. Wang, V. S. Thang, Z. W. Zhong, N. F. de Rooij, "Investigation of hot roller embossing for microfluidic devices", Journal of Micromechanics and Microengineering, Vol. 20, pp 015017, 2010.
  4. A. G. G. Toh, S. H. Ng, Z. F. Wang, "Fabrication and testing of embedded microvalves within PMMA microfluidic devices", Microsystem Technologies, Vol. 15, pp. 1335-1342, 2009.
  5. S. H. Ng, Z. F. Wang, "Hot roller embossing for microfluidics: process and challenges", Microsystem Technologies, Vol. 15, pp. 1157-1162, 2009.
  6. L. P. Yeo, S. H. Ng, Z. F. Wang, Z. P. Wang, N. de Rooij, "Micro-fabrication of polymeric devices using hot roller embossing", Microelectronics Engineering, Vol. 86, pp. 933-936, 2009.
  7. S. H. Ng, Z. F. Wang, N. de Rooij, "Microfluidic connectors by ultrasonic welding", Microelectronics Engineering, Vol. 86, pp. 1354-1357, 2009.
  8. J. R. W. Tew, L. S. K. Goi, L. H. Xiao, W. C. Lim, Z. F. Wang, G. Y. Li "Influence of Radiative energy transfer on the thermal behavior of bonded InGaAs/GaAs lasers", IEEE Transactions on Advanced Packaging, Vol. 32, pp. 130-135, 2009.
  9. J. R. W. Tew, X. Q. Shi, S. Yuan, G. Y. Li, Z. F. Wang, "Modified face-down bonding of ridge-waveguide laser using hard solder", IEEE Transactions on Electronic Packaging and Manufacturing, Vol. 31, pp. 159-167, 2008.
  10. K. P. Yung, J. Wei, Z. F. Wang, B. K. Tay, "Effects of Under CNT Metallization Layers on Carbon Nanotubes Growth", Modern Physics Letters B, Vol. 22, pp. 1827-1836, 2008.
  11. S. H. Ng, R. T. Tjeung, Z. F. Wang, A. C. W. Lu, I. Rodriguez, N. de Rooij, "Thermally Activated Solvent Bonding Of Polymers", Microsystem Technologies Vol. 14, pp. 753-759, 2008.
  12. J.W.R. Tew, Z.F. Wang, X.Q. Shi, G.Y. Li, S. Yuan, "Influence of bonding temperature and applied load on the optical performance and bonding integrity of face-down bonded ridge-waveguide lasers", Journal of Electronics Material, Vol. 36, pp. 1635-1642, 2008.
  13. J. R. W. Tew, F. L. Ng, L. S. K. Goi, Y. F. Sun, Z. F. Wang, X. Q. Shi, J. Wei, G. Y. Li, "Microstructure of eutectic 80Au/20Sn solder joint in laser diode package", Microelectronics Engineering, Vol. 85, pp. 512-517, 2008.
  14. J. R. W. Tew, G. Y. Li, M. S. Lin, Z. F. Wang, X. Q. Shi, "Parametric investigation of laser diode bonding using eutectic AuSn solder", Thin Solid Films, Vol. 515, pp. 4340-4343, 2007.
  15. Y. F. Jin, H. Tang, Z. F. Wang, "Micro/Nano Film Getters for Vacuum Maintenance of MEMS", Key Engineering Materials, Vol. 353-358, pp. 2924-2927, 2007.
  16. X. Q. Xu, D. L. Butler, S. H. Ng, Z. F. Wang, S. Danyluk, C. Yang, "Simulation of droplet formation and coalescence using lattice Boltzmann-based single-phase model", Journal of Colloid and Interface Science, Vol. 311, pp. 609-618, 2007.
  17. Z. W. Zhong, Z. F. Wang, B. M. P. Zirajutheen, Y. S. Tan, Y. H. Tan, "Polishing of Poly Methyl Methacrylate, Polycarbonate and SU-8 Polymers", Materials Science-Poland, Vol. 25, pp. 103-112, 2007.
  18. Z.F. Wang, W. Noell, M. Zicker, N.F. de Rooij, S.P. Lim, "A new scanning MEMS mirror", Microsystem Technologies, Vol. 13, pp. 1595-1600, 2007.
  19. S.H. Ng, Z.F Wang, R.T Tjeung, N.F. De Rooij, "Development of a multi-layer microelectrofluidic platform", Microsystem Technologies, Vol. 13, pp. 1509-1516, 2007. 
  20. Z.F. Wang, W.Q. Cao, Z. Lu, "MOEMS: packaging and testing", Microsystem Technologies, Vol. 12, pp. 52-58, (2005).
  21. Z.F. Wang, M. Wu, X.C. Shan, J.S. Hua, "MEMS-based combustor with Hairpin-Shape design of gas recirculation channel", Microsystem Technologies, Vol. 12, pp. 993-998, 2006. 
  22. Z.F. Wang, W.Q. Cao, X.C. Shan, J. F. Xu, S. P. Lim, W. Noell, N. F. de Rooij, "Development of 1×4 MEMS-based optical switch", Sensors and Actuators A, Vol. 114, pp. 80-87, 2004.

Conference Paper

  1. S.H. Ng, R.T. Tjeung, Z.F. Wang, "A high-performance bonding technique for homogeneous polymeric microfluidic devices", the 11th International Conference on Miniaturized Systems for Chemistry and Life Sciences (µTAS 2007), Paris, France, 7-11 Oct 2007, pp. 1125-1127.
  2. S.H. Ng, Z.F. Wang, N. de Rooij, "Large panel hot roller embossing for polymeric microfluidic devices", the 11th International Conference on Miniaturized Systems for Chemistry and Life Sciences (µTAS 2007), Paris, France, 7-11 Oct 2007, pp. 1738-1740.