Researcher Portfolio

Ng Sum Huan Gary (Dr)
Scientist III
67938382
Microfluidics Manufacturing
Introduction:He joined SIMTech (previously Gintic) in 1999 and is presently a research scientist under the Microfluidics Manufacturing Programme. He has authored over 40 journal and conference papers.
Research Interest:Microfluidics, BioMEMS, Lab-on-a-chip, Microfabrication such as micro/nano patterning and micro joining, Micromachining processes such as chemical mechanical polishing (CMP).
BioNotes:

Ph.D. (Mechanical)  - Georgia Institute of Technology

MBA - Nanyang Technological University

M.Eng. (Mechanical) - National University of Singapore

B.Eng. (Mechanical) - National University of Singapore

Publications:

Journal Paper:

  1. S.H. Ng, Y.X. Wu, Z.F. Wang, and Z.P. Wang, "Corona discharge assisted thermal bonding of polymer microfluidic devices," Journal of Microsystem Technologies, 2010, Vol. 16(7), pp. 1181-1186.
  2. L.P. Yeo, S.H. Ng, Z.F. Wang, H.M. Xia, Z.P Wang, V.S. Thang, Z.W. Zhong, and N.F. de rooij, "Investigation of hot roller embossing for microfluidic devices," Journal of Micromechanics and Microengineering, 2009, Vol. 20(1), pp. 1-10.
  3. S.H. Ng and Z.F. Wang, "Hot roller embossing for microfluidics: process and challenges," Microsystem Technologies, 2009, Vol. 15(8), pp. 1149-1156.
  4. L.P. Yeo, S.H. Ng, Z.F. Wang, Z.P. Wang, and N.F. de rooij, "Micro-fabrication of polymeric devices using hot roller embossing," Microelectronic Engineering, 2009, Vol. 86(4-6), pp. 933-936.
  5. S.H. Ng, Z.F. Wang, and N.F. de rooij, "Microfluidic connectors by ultrasonic welding," Microelectronic Engineering, 2009, Vol. 86(4-6), pp. 1354-1357.
  6. S.H. Ng, R.T. Tjeung, Z.F. Wang, A.C.W. Lu, I. Rodriguez, and N.F. de rooij, "Thermally activated solvent bonding of polymers," Journal of Microsystem Technologies, 2008, Vol. 14(6), pp. 753-759.
  7. S.H. Ng, Z.F. Wang, R.T. Tjeung, and N.F. de Rooij, "Development of a multi-layer microelectrofluidic platform," Journal of Microsystem Technologies, 2007, Vol. 13, pp. 1509-1515.
  8. X.Q. Xing, D.L. Butler, S.H. Ng, Z.F. Wang, S. Danyluk and C. Yang, "Simulation of droplet formation and coalescence using Lattice Boltzmann based single-phase model," Journal of Colloid and Interface Science, Vol. 311, pp. 609-618.
  9. S.H. Ng, L. Borucki, C.F. HiggsIII, I. Yoon, A. Osorno, and S. Danyluk, "Tilt and interfacial fluid pressure measurements of a disk sliding on a polymeric pad," ASME Journal of Tribology, 2005, 127, 1, pp. 198-205.
  10. S.H. Ng, C.F. HiggsIII, I. Yoon, and S. Danyluk, "An analysis of mixed lubrication in chemical mechanical polishing," ASME Journal of Tribology, 2005, 127, pp. 287-292.
  11. L. Borucki, S.H. Ng, and S. Danyluk, "Fluid pressures and pad topography in chemical mechanical polishing," Journal of the Electrochemical Society, 2005, 152, 5, pp. G391-397.
  12. S.H. Ng, I. Yoon, C.F. HiggsIII, and S. Danyluk, "Wafer-bending measurements in CMP," Journal of the Electrochemical Society, 2004, 151, 12, pp. G819-G823.
  13. S.H. Ng, R. Hight, C. Zhou, I. Yoon, and S. Danyluk, "Pad soaking effect on interfacial fluid pressure measurements during CMP," ASME Journal of Tribology, 2003, 125, pp. 582-586.
  14. C. Zhou, L. Shan, J.R. Hight, S.H. Ng, and S. Danyluk, "Fluid pressure and its effects on chemical mechanical polishing," Wear, 2002, 253, pp. 430-437.
  15. C. Zhou, L. Shan, J.R. Hight, S. Danyluk, A. Paszkowski, and S.H. Ng, "Influence of colloidal abrasive size on material removal rate and surface finish in SiO2 chemical mechanical polishing," Tribology Transactions, 2002, 45, 2, pp. 232-238.
  16. C.F. HiggsIII, S.H. Ng, L. Borucki, I. Yoon, and S. Danyluk, "A mixed-lubrication approach to predicting CMP fluid pressure modeling and experiments," Journal of the Electrochemical Society, 2005, 152, 3, pp. 1-6.

 

 Conference Paper:

  1. S.H. Ng, Y.X. Wu, Z.F. Wang, and Z.P. Wang, "Rapid thermal bonding of polymer microfluidic devices assisted by corona discharge," Design, Test, Integration & Packaging of MEMS/MOEMS 2009, 01-Apr-2009 to 03-Apr-2009, Rome, Italy, vol. 1, pp. 343-348.
  2. S.H. Ng, Z.F. Wang, and N.F. de rooij, "Microfluidic connection by ultrasonic welding," 34th International Conference on Micro and Nano Engineering 2008, 15-Aug-2008 to 18-Aug-2008, Greece, vol. 1, pp. 550-550.
  3. S.H. Ng and Z.F. Wang, "Hot roller embossing for the creation of microfluidic devices," Design, Test, Integration and Packaging of MEMS/MOEMS, 09-Apr-2008 to 11-Apr-2008, France, Vol. 1, pp. 262-266.
  4. S.H. Ng, R.T. Tjeung and Z.F. Wang, "A high-performance bonding technique for homogeneous polymeric microfluidic devices", MicroTAS 2007, 7-11 Oct 2007, Paris, France, Vol. 2, pp. 1125-1127.
  5. S.H. Ng, Z.F. Wang and N.F. de Rooij, "Large panel hot roller embossing for polymeric microfluidic devices", MicroTAS 2007, 7-11 Oct 2007, Paris, France, Vol. 2, pp. 1738-1740.
  6. S.H. Ng, R.T. Tjeung and Z.F. Wang, "Formation of embedded microchannels by a solvent displacement bonding technique", 9th Electronics Packaging Technology Conference (EPTC 2007), 10-12 Dec 2007, Singapore, Vol. 1, pp. 211-214.
  7. S.H. Ng, R.T. Tjeung, Z.F. Wang, A.C.W. Lu, I. Rodriguez, and N.F. de Rooij, "Formation of embedded microstructures by thermal activated solvent bonding," Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2007), 25-27 Apr 2007, Stresa, Italy, Vol. 1, pp. 173-178.
  8. S.H. Ng, Z.F. Wang, and R.T. Tjeung, "Process issues for a multi-layer microelectrofluidic platform," Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2006), 26-28 Apr 2006, Stresa, Lake Maggiore, Italy, pp. 195-200.
  9. S.H. Ng, R.T. Tjeung, and Z.F. Wang, "Hot embossing on polymethyl methacrylate," 8th Electronics Packaging Technology Conference (EPTC 2006), 6-8 Dec 2006, Singapore, Vol. 2, pp. 615-621.
  10. S.H. Ng, C. M. Zettner, C. Zhou, I.-H. Yoon, S. Danyluk, M. Sacks, and M. Yoda, 2003, "Nanoparticulate and Interfacial Mechanics in Confined Geometries Typical of Chemical-Mechanical Planarization," Proceedings of IMECE'03, Washington, D.C., U.S.A.
  11. S.H. Ng, L. Borucki, C.F. HiggsIII, I. Yoon, A. Osorno, and S. Danyluk, 2004, "Two-dimensional modeling of interfacial mechanics during chemcial mechanical polishing," WCCM VI and APCOM, Beijing, China.