Researcher Portfolio

Teo Jin Wah (Dr)
Scientist III
6590 3180
Joining Technology
Introduction:

Ronnie TEO Jin Wah received his B.Eng degree in electrical & electronics engineering from University of Glasgow, Scotland, in 2001, and Ph.D. degree in Materials Science & Engineering from Nanyang Technological University, Singapore, in 2007. Dr. Teo has started his career with Singapore Institute of Manufacturing Technology since 2001 and is an adjunct lecturer in the School of Engineering from the University of Glasgow. He has worked on failure analysis and reliability assessment of high-power electronics and optoelectronics applications. His research interests include micro-joining technologies, failure analysis, thermal management and accelerated reliability testing methodologies. 

Research Interest:LED Reliability, Failure Analysis, Accelerated Testing Methodology
BioNotes:Ministry of Trade & Industry's Borderless Award 2011
A*STAR's Borderless Award 2011 
T-Up Excellence Award 2011
Publications:

J.W.Ronnie Teo, "Thermal Cycling Aging Effect on the reliability and morphological evolution of SnAgCu Solder Joints", IEEE Trans Electron Packag Manufact, Vol. 30(5), pp. 279 - 284, 2007.

J.W.Ronnie Teo and Y.F. Sun, "Spalling Behavior of Intermetallic Grains in Pb-free Solder Joint subjected to Temperature Cycling Loading", Acta Mater., Vol. 56(2), pp. 242-249, 2008.

J.W.Ronnie Teo, "Microstructure and failure mode of Sn-63Pb soldered in laser diode packages", Intermetallics, Vol. 16293-298, 2008.

J.W.Ronnie Teo, X.Q. Shi, S. Yuan, G.Y. Li, and Z.F. Wang, "Modified Face-Down Bonding of Ridge-Waveguide Lasers Using Hard Solder", IEEE Trans. Comp. and Packag. Technol., Vol. 31(2), pp. 159-167, 2008.

J.W.Ronnie Teo, F.L. Ng, L.S.K. Goi, Y.F. Sun, Z.F. Wang, X.Q. Shi, J. Wei, and G.Y. Li, "Microstructure of Eutectic 80Au/20Sn solder joint in Laser Diode Package", J. Electron. Mater., Vol. 85(3), pp. 512-517, 2008.