The pervasiveness of the Internet of Things (IoT), cloud computing and Big Data have resulted in a global demand for efficient and cost effective data system technologies. In response to this, the industry has been innovating novel solutions for data centres to address these challenges.
In the Semiconductor sector, a key driving force behind the rapid growth in advanced packaging is the semiconductor industry’s realisation that it would not be able to achieve further scaling of transistors while sustaining Moore’s law without an increase in the cost per transistor. To address this issue, the industry has been actively seeking alternative ways to further improve transistor performance.
A key driving force behind the rapid growth in advanced packaging is the semiconductor industry’s realisation that it would not be able to achieve further scaling of transistors while sustaining Moore’s law without an increase in the cost per transistor. To address this issue, the industry has been actively seeking alternative ways to further improve transistor performance. A*STAR has been actively developing and extending our capabilities in semiconductor technologies in order to solve the key technical challenges faced by the semiconductor companies.
- Advanced Semiconductor Joint Labs
Following the success of Applied Materials-IME COE in Advanced Packaging, in July 2014, A*STAR has launched four joint laboratories, representing a commitment of S$200 million between private and public sectors.
The four joint labs in lithography, WLP, metrology and assembly provide an integrated platform for semiconductor R&D, starting with patterning, further development of 3D Integrated Circuits (IC), quality control, and finally, the assembly and high-volume manufacturing of chips.
The industry partners involved in this international collaboration are Applied Materials, Dai Nippon Printing, DISCO, KLA-Tencor, Mentor Graphics, Nikon, Panasonic Factory Solutions Asia Pacific, PINK, Tokyo Electron Ltd. and Tokyo Ohka Kogyo.
- High-density Fan-Out Wafer-Level-Packaging (FOWLP)
A*STAR has also launched the High-Density Fan-Out Wafer Level Packaging (FOWLP) consortium in April 2015 to extend FOWLP capabilities for applications in devices such as smart phones, tablets, navigation tools and gaming consoles. Members of the consortium included Amkor Technologies, NANIUM, STATS ChipPAC, NXP Semiconductors, GLOBALFOUNDRIES, Kulicke & Soffa, Applied Materials, Inc., Dipsol Chemicals, JSR Corporation, KLA-Tencor, Kingyoup Optronics, Orbotech and Tokyo Ohka Kogyo.
A*STAR’s Institute of Microelectronics (IME) has effectively built a suite of capabilities for “More-than-Moore” technologies such as silicon photonics, Microelectromechanical systems (MEMS), sensors and energy harvesters. Using IME’s advanced packaging techniques, these “More-than-Moore” technologies can be packed closer together to achieve system level integration, reducing the parasitic resistance in the electronic device and improving the device’s performance.
DATA SYSTEMS TECHNOLOGIES
Hitachi Asia Ltd.
Hitachi Asia Ltd. and DSI collaborated to devise a data compression technique to tackle the increasing volume of genome sequencing data generated by the health-care and biomedical industry.
“We are delighted to continue our long-standing partnership with DSI in the research field of networked storage. As the industry leader in storage technology and bioinformatics software solutions, I am confident that the outcome of this collaboration will lead to more innovative solutions that could potentially be one of Hitachi’s future areas of business expansion.”
Mr Makoto Nagashima, Managing Director of Hitachi Asia Ltd.
The Advanced Semiconductor Joint Labs, launched in July 2014, will develop and advance semiconductor technologies for future electronics markets. The four joint labs in lithography, WLP, metrology and assembly provide an integrated platform for semiconductor R&D, starting with patterning, further development of 3D Integrated Circuits (IC), quality control, and finally, the assembly and high-volume manufacturing of chips.
“At Applied, we believe that broad collaboration generates creative solutions that enable major technology inflections, and our partnership with A*STAR IME is an outstanding example. By combining great ideas and capabilities from industry and research institutes, we are accelerating innovation needed to bring next-generation technology to market faster and more cost-effectively.”
Gary Dickerson, President and CEO, Applied Materials
“Our collaboration with A*STAR IME will strengthen our knowledge of future process control trends, driving technology development for our next-generation tools. We look forward to working with IME on advanced semiconductor research and to developing yield management strategies that can be shared with semiconductor manufacturers.”
Rick Wallace, President and Chief Executive Officer, KLA-Tencor
“Through this collaboration with A*STAR IME, Nikon will gain knowledge of future process technology and total solutions, which will be important for our lithography system development. We are very excited to partner one of the most advanced and established institutes in the Asia region.”
Kazuo Ushida, President and Representative Director, Nikon Corporation
Panasonic Factory Solutions Co., Ltd
“Panasonic Factory Solutions Co., Ltd. is continually conducting extensive research to develop and create technologies that can help its customers to achieve competitive edge in productivity and create value-added solutions to their customers. We are confident that the strategic alliance with A*STAR and Joint-Lab members will result in the development of advanced flip chip bonding technologies that will support next generation’s semiconductor packaging.”
Katsuhiko Omoto, President, Panasonic Factory Solutions Co., Ltd
Tokyo Electron Ltd
“It is increasingly important to collaborate with consortia, academia and industry in developing innovations. Through innovation, we can produce cost-effective technologies and create future industry demand. This collaborative platform with A*STAR IME will play a key role in enhancing both the innovation and the global ecosystem.”
Dr Gishi Chung, Senior Vice President and General Manager of SPE
Marketing & Process Development Division of Tokyo Electron Ltd