Technology Overview

The Intelligent Product Verification Group (IPV) brings intelligent data-driven solutions to industry members for automated product inspection, measurement, defect detection, predictive maintenance, and process improvement. IPV exploits leading technologies and sensors in non-destructive evaluation, machine visions, measurement, and condition monitoring, supported by complex signal and image processing algorithms enhanced by artificial intelligence, to deliver customised solutions for our members’ requirements.


  • Non-destructive defect detection in metals, non-metals, and composites 
  • Verification of additively and conventionally manufactured components
  • In-situ in-line vision inspection on the production line
  • Machine failure monitoring and predictive maintenance in real-time
  • Novel applications of sensor technologies for part quality and process monitoring
  • Part quality verification (dimension and geometry) and reverse engineering



  • Automated in-line product-centric optical inspection system design and implementation
  • Surface defect detection with knowledge-driven data acquisition setup and AI
  • In-situ measurement of complex surface topography
  • Non-contact dimensional measurement for surface geometry features and defects

Non-Destructive Evaluation

  • Advanced NDT techniques (ultrasonic and eddy current arrays, air-coupled ultrasonic testing, high-frequency eddy current, thermography)
  • X-ray CT for volumetric inspection
  • Capacitive imaging and optical coherence tomography
  • Automated NDT scanning (C-scan, cobot, and mobile platforms)
  • NDT simulation (aRTist, CIVA, ANSYS)

Condition Monitoring

  • Real-time machine and tool health condition monitoring for process optimisation and predictive maintenance 
  • Novel and optimal in-machine and in-process sensorisation and data acquisition
  • Predictive analytics enabled by advanced machine learning methods such as transfer learning and domain adaptation 


  • Contact and non-contact dimensional and surface topography assessment (GOM, CMM, white light interferometers, confocal microscope)
  • High accuracy in-situ dimensional and roughness measurement
  • Adaptive feedback control via M2M connectivity
  • 3D data processing and reverse engineering (for process optimisation)