R&D Capabilities

Surface Analytical Laboratory

The rapid growth of electronics industries has resulted in components with increasing complexities, devices with shrinking dimensions, and signals with reducing margins. The defects and contaminations that can cause products to fail are shrinking in sizes and reducing in amount.  For small features on the order of sub-microns or nanometers, more sophisticated analytical tools are required to produce results that are accurate, precise, repeatable, and traceable. The tools in the Surface Analytical Laboratory are equipped with high spatial resolution, high depth resolution, and high chemical sensitivity capabilities and are often used to (1) analyze the compositional changes in thin films or small particles on sub-micron levels and (2) detect the trace amount of materials on sample surfaces.   The analysis performed using these instruments often lead to finding the root-cause of failures and understanding of the underlying mechanisms.

We have the following analytical equipment for surface and thin film analysis:

  • Atomic Force Microscopy
  • Auger Electron Spectroscopy
  • Eillpsometer
  • Optical Surface Analyzer
  • Standard Contact Angle Goniometer
  • Surface Profiler
  • Time-of-Flight Secondary Ion Mass Spectroscopy
  • X-Ray Photoelectron Spectroscopy 

• High spatial resolution surface morphology and material composition analysis and imaging of defect
  contamination on hard disk media and heads

• Surface adsorption analysis

• Surface and interface analysis for micro-contamination and defect control

• Ultra-thin film characterization

• Multilayer structural characterization and diffusion analysis at multilayer interface

• Failure analysis for identifying micro contaminants and defects, determine root-cause of failure and 
  failure Mechanism

• Material characterization and failure analysis in data storage area
 -Micro contamination analysis on hard disk media, heads and all hard disk components
 -Nanometer thick lubricant film characterization
 -Hard disk lubricant film material composition analysis, bonding ratio analysis, thickness, uniformity and mobility
 -Carbon overcoat property characterization and analysis

• Micro contamination analysis on plasma cleaned flexible circuit

• Micro contamination analysis for semiconductor wafer

• Micro contamination analysis for printer cartridge components

• Micro contamination analysis for leadframe, bondpad components, LED devices, PV films

• Micro-diffraction, EDS, stress-strain analysis and microstructure study of materials

Who to Contact:
Dr Ji Rong
E: ji_rong@imre.a-star.edu.sg