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Dr. Liu En-Xiao

liuex@ihpc.a-star.edu.sg

Title: Deputy Department Director , Senior Scientist
Tel: 64191524

Research Interest

  • Integrated Circuit (IC) and Advanced Interconnects & Packaging: Signal/Power integrity (SI/PI), IR drop analysis, Electromagnetic interference study, 3D IC & TSV
  • Electromagnetic Compatibility (EMC): Board- & system-level EMC, Radiation analysis, Lightning protection simulation
  • Computational Electromagnetics: FDTD, FDFD, IE (MoM): Application specific algorithms; Hybrid methods
  • Multi-physics Modeling: Electrical-thermal modeling; Device-system modeling

Qualifications

  • Ph.D., Electrical Engineering, National University of Singapore, 2005
  • M. Eng. (99) and B. Eng. (96), Xi’an Jiaotong University, China

Journals

  1. E. Sicard, W. Jianfei, R. J. Shen, E. P. Li, E. X. Liu, J. Kim, J. Cho, and M. Swaminathan, "Recent advances in electromagnetic compatibility of 3D-ICs: Part II," IEEE Electromagnetic Compatibility Magazine, vol. 5, no. 1, pp. 65-74, May 2016.
  2. V. P. Bui, W. Thitsartarn, E.-X. Liu, J. Y. C. Chuan, and E.-K. Chua, "EM Performance of Conductive Composite Laminate Made of Nanostructured Materials for Aerospace Application," IEEE Trans. Electromagn. Compat., vol. 57, no. 5, pp. 1139-1148, 2015.
  3. H. M. Lee, S.-P. Gao, E.-X. Liu, G. S. Samudra, and E.-P. Li, "Two-Dimensional Discontinuous Galerkin Time-Domain Method for Modeling of Arbitrarily Shaped Power-Ground Planes," IEEE Trans. Electromagn. Compat., vol. 57, no. 6, pp. 1744-1747, 2015.
  4. E. Sicard, W. Jianfei, R. J. Shen, E. P. Li, E.-X. Liu, J. Kim, J. Cho, and M. Swaminathan, "Recent advances in electromagnetic compatibility of 3D-ICs: Part I," IEEE Electromagnetic Compatibility Magazine, vol. 4, no. 4, pp. 79-89, 2015.
  5. Huapeng Zhao, En-Xiao Liu, Jun Hu and Er-Ping Li, “Fast Contour Integral Equation Method for Wideband Power Integrity Analysis,” IEEE Trans. on CPMT, pp. 1317-1324, vol.4, no. 8, Aug. 2014.
  6. Wei-Jiang Zhao, Bin-Fang Wang, En-Xiao Liu, HarkByeong Park, Hyun Ho Park, Eakhwan Song, and Er-Ping Li, "An effective and efficient approach for radiated emission prediction based on amplitude-only near-field measurements," IEEE Trans. on EMC, vol. 54, no. 5, pp. 1186-1189, Oct. 2012.
  7. Z. Z. Oo, E.-X. Liu, X.-C. Wei, Y. Zhang, and E.-P. Li, "Cascaded microwave network approach for power and signal integrity analysis of multilayer electronic packages," IEEE Trans. Compon. Packag. Technol. , vol. 1, no. 9, pp. 1428-1437, Sept. 2011.
  8. E.-X. Liu, E.-P. Li, W. -B. Ewe, H. M. Lee, T. G. Lim, and S. Gao, " Compact Wideband Equivalent Circuit Model for electrical modeling of Through-silicon via," IEEE Trans. Microwave Theory Tech., vol. 59, No. 6, pp. 1454-1460, Jun 2011.
  9. E.-P. Li, X. Wei, A. C. Cangellaris, E.-X. Liu, Y. Zhang, et al., "Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects," IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 248-265, May 2010 (invited paper).
  10. Y. J. Zhang, Z. Z. Oo, X. C. Wei, E.-X. Liu, J. Fan, and E. P. Li, "Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors," IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 401-409, 2010.
  11. E.-X. Liu, E.-P. Li, Z. Z. Oo, X. Wei, Y. Zhang, and R. Vahldieck, "Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures," IEEE Trans. Microwave Theory Tech., vol. 57, no. 7, pp. 1724-1733, Jul. 2009.
  12. Z. Z. Oo, E. P. Li, X. C. Wei, E.-X. Liu, Y. J. Zhang, and L.-W. Li, "Hybridization of the Scattering Matrix Method and Modal Decomposition for Analysis of Signal Traces in a Power Distribution Network," IEEE Trans. Electromagn. Compat., vol. 51, no. 3, pp. 784-791, Aug. 2009.
  13. Z. Z. Oo, E.-X. Liu, E.-P. Li, X. C. Wei, Y. Zhang, et al., "A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias," IEEE Trans. Adv. Packag., vol. 31, no. 2, pp. 267-274, May 2008.
  14. X. C. Wei, E.-P. Li, E.-X. Liu, and R. Vahldieck, "Efficient Simulation of Power Distribution Network by Using Integral Equation and Modal Decoupling Technology," IEEE Trans. Microwave Theory Tech., vol. 56, no. 10, pp. 2277-2285, Oct. 2008.
  15. X. C. Wei, E.-P. Li, E.-X. Liu, and X. Cui, "Efficient Modeling of Rerouted Return Currents in Multilayered Power-Ground Planes by Using Integral Equation," IEEE Trans. Electromagn. Compat., vol. 50, no. 3, pp. 740-743, Aug. 2008.
  16. X. C. Wei, E.-P. Li, E.-X. Liu, E. K. Chua, Z. Z. Oo, and R. Vahldieck, "Emission and Susceptibility Modeling of Finite-Size Power-Ground Planes Using a Hybrid Integral Equation Method," IEEE Trans. Adv. Packag., vol. 31, no. 3, pp. 536-543, Aug. 2008.
  17. E.-X. Liu, E.-P. Li, and L.-W. Li, "Analysis of multilayer planar circuits by a hybrid method," IEEE Microwave Wireless Components Lett., vol. 16, no. 2, pp. 66-68, Feb. 2006.
  18. E.-X. Liu, E.-P. Li, and L.-W. Li, "Hybrid FDTD-MPIE method for the simulation of locally inhomogeneous multilayer LTCC structure," IEEE Microwave Wireless Components Lett., vol. 15, no. 1, pp. 42-44, Jan. 2005.
  19. E.-X. Liu, E.-P. Li, L.-W. Li, and Z. Shen, "Finite-difference time-domain macromodel for simulation of electromagnetic interference at high-speed interconnects," IEEE Trans. Magn., vol. 41, no. 1, pp. 65-71, Jan. 2005.
  20. E.-P. Li, E.-X. Liu, L.-W. Li, and M.-S. Leong, "A coupled efficient and systematic full-wave time-domain macromodeling and circuit Simulation method for signal integrity analysis of high-speed interconnects," IEEE Trans. Adv. Packag., vol. 27, no. 1, pp. 213-223, Feb. 2004.
  21. E.-X. Liu, E.-P. Li, and L.-W. Li, "Analysis of signal propagation on high-speed planar interconnect systems based on full-wave and macromodeling technique," Microwave Opt. Technol. Lett., vol. 39, no., pp. 183-187, Nov. 2003.

Book Chapter(s)

Two chapters in Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC, ISBN: 978-0470623466, IEEE Press and John Wiley, New York, April 2012, http://www.amazon.com/Electrical-Modeling-Design-System-Integration/dp/0470623462:

  1. En-Xiao Liu, and Er-Ping Li, “Chapter 2: Macromodeling of Complex Interconnects in 3D integration”
  2. En-Xiao Liu, “Chapter 6: Modeling of Through-Silicon Vias in 3D Integration”

Conferences

(Past five years)

  1. En-Xiao Liu, X.-C. Wei, E.-P. Li, "2.5D Methodologies for Electronic Package and PCB Modeling: Review and Latest Development, " IEEE International Symposium on Electromagnetic Compatibility, Canada, 25-29 July 2016
  2. Si-Ping Gao, Hui Min Lee, Xian-Ke Gao, En-Xiao Liu, Ching Eng Png, "Exploration of Design Guidelines for Cavity-backed Dumbbell-shaped DGS Common-Mode Filters, " IEEE NEMO, China, 27-29 July 2016
  3. Si-Ping Gao, Hui Min Lee, Xian-Ke Gao, Pingfang Yu, Cunhui Zhan, Xueli Feng, En-Xiao Liu, Ching Eng Png, "Common-Mode Filter using Cavity-Backed Defected Ground Structure for Multilayer PCB, " IEEE APEMC, China, 18-21 May 2016
  4. En-Xiao Liu, Hui Min Lee, Siping Gao, G. S Samudra, and Er-Ping Li, "Two-dimensional Discontinuous Galerkin Time-Domain Method for Power Integrity Modeling, " IEEE APEMC, China, 18-21 May 2016
  5. Hui Min Lee, En-Xiao Liu, G. S. Samudra, Er-Ping Li, “Power integrity modeling, measurement and analysis of seven-chip stack for TSV-based 3D IC integration,” in Proc. 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 25-29 May, 2015, Taiwan.
  6. S.-P. Gao, H. Zhao, B. Wang, W.-J. Zhao, and E.-X. Liu, "Surrogate-model based isolation analysis of slotted waveguide antennas," in Proc. IEEE 4th Asia-Pacific Conference on Antennas and Propagation (APCAP), Indonesia, June 30 -July 3 2015, pp. 447-448.
  7. Y. Yu, Q. Li, E. Liu, C. E. Png, and X. Su, "Simulation of dispersive plasmas using implicit and explicit ADE-FDTD schemes," in Proc. IEEE 4th Asia-Pacific Conference on Antennas and Propagation (APCAP), Indonesia, June 30 2015-July 3 2015 2015, pp. 128-129.
  8. X.-K. Gao, H. M. Lee, S. Gao, E.-X. Liu, and C. E. Png, "A compact common-mode noise suppression filter for high speed differential signals using defected ground structure," in Proc. APEMC, Taiwan, 26-29 May 2015, pp. 685-688.
  9. H. M. Lee, E.-X. Liu, G. S. Samudra, and E.-P. Li, "Power integrity modeling, measurement and analysis of seven-chip stack for TSV-based 3D IC integration," in Proc. APEMC, Taiwan, 26-29 May 2015, pp. 689-692.
  10. H. Zhao, W. Zhao, E.-X. Liu, and C. E. Png, "Iteration-free phase retrieval for amplitude-only near to far field transformation," in Proc. 1st URSI AtlanticRadio Science Conference (URSI AT-RASC), , Gran Canaria : Spain, 16-24 May 2015, pp. 1-1.
  11. E.-X. Liu, B. V. Phuong, W. Thitsartarn, C. He, and J. Yeo, "EMC analysis and characterization of new nanocomposite laminates for aeronautic application," in Proc. IEEE Int. Symp. Electromagn. Compat., Dresden : Germany, 16-22 Aug. 2015 2015, pp. 1117-1121.
  12. W. J. Zhao, B. Wang, and E. X. Liu, "A differential evolution algorithm based source reconstruction technique," in Proc. EMC Europe, Gothenburg, 1-4 Sept. 2014, pp. 119-123.
  13. H. Zhao, E.-X. Liu, and E.-P. Li, "Contour Integral Equation and Vector Fitting Based Adaptive Frequency Sampling for Fast Wide-Band Analysis of Power Ground Plane Pair," in Asia-Pacific Symposium on Electromagnetic Compatibility, Melbourne, Australia, May 2013, pp. 1-4.
  14. W.-J. Zhao, B. Wang, E.-X. Liu, H. B. Park, H. H. Park, S. Eakhwan, and E.-P. Li, "A differential evolution based equivalent source approach for predicting electromagnetic emissions using near-field scanning," in Proc. IEEE Int. Symp. Electromagn. Compat., Denver, CO, Aug. 2013, pp. 182-186.
  15. E.-X. Liu and E.-P. Li, "Fast voltage drop modeling of power grid with application to silicon interposer analysis," in IEEE 63rd Electronic Components and Technology Conference (ECTC), LV: Nevada, 28-31 May 2013, pp. 1109-1114.
  16. H. M. Lee, E.-P. Li, E.-X. Liu, and G. S. Samudra, "Comprehensive study of the impact of TSV induced thermo-mechanical stress on 3D IC device performance," in Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE, 12-15 Dec. 2013, pp. 36-39.
  17. Z. Z. Oo, E.-X. Liu, J. R. Cubillo, and E.-P. Li, "Systematic analysis for static and dynamic drops in power supply grids of 3-D integrated circuits," in Asia-Pacific Symposium on Electromagnetic Compatibility, Singapore, May 2012, pp. 49-52.
  18. X. C. Wei, Z. Z. Oo, E.-X. Liu, and E.-P. Li, "Power integrity analysis of TSV based 3-D integrated circuits," in International Conference on Microwave and Millimeter Wave Technology, Shenzhen, China, May 2012, pp. 1-4.
  19. E.-P. Li and E.-X. Liu, "Domain and modal decomposition for efficient signal and power integrity analysis of multilayer packages and PCBs," in IEEE MTT-S International Microwave Symposium, Montreal, Canada, June 2012, pp. 1-3.
  20. J. R. Cubillo, R. Weerasekera, Z. Z. Oo, E.-X. Liu, B. Conn, S. Bhattacharya, and R. Patti, "Interconnect design and analysis for Through Silicon Interposers (TSIs)," in 3D Systems Integration Conference (3DIC), 2011 IEEE International, Osaka, Japan, Jan. 2012, pp. 1-6.
  21. W.-J. Zhao, H. B. Park, M. Tan, H. H. Park, E.-X. Liu, E. Song, and E.-P. Li, "Far-field prediction from amplitude-only near-field measurements using equivalent electric currents," in IEEE International Symposium on Electromagnetic Compatibility (EMC), Pittsburgh, PA, Aug. 2012, pp. 590-593.
  22. H. M. Lee, E.-X. Liu, G. S. Samudra, and E.-P. Li, "Impact of TSV induced thermo-mechanical stress on semiconductor device performance," in IEEE Electrical Design of Advanced Packaging and Systems Symposium, Hangzhou, China, 9-11 Dec. 2012, pp. 189-192.
  23. E.-X. Liu, J. R. Cubillo, E.-P. Li, H. Zhao, Z. Z. Oo, and H. M. Lee, "Effective resistance approach for DC analysis of power grid on through-silicon interposer (TSI)," in IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Taiwan, 9-11 Dec. 2012, pp. 1-4.
  24. W. Z. Zhang, E. X. Liu, and E. P. Li, "Modeling multilayer power/ground planes in printed circuit boards and electronic packages using microwave networks," in Proc. IEEE 14th Electronics Packaging Technology Conference, Singapore, 5-7 Dec. 2012, pp. 637-640.

Other(s)

Public & Private (Industry) Funding Projects

  • Enxiao has performed in various capacities, such as principal investigator, co-(principal) investigator, project Leader, and Key Team Member, both for public and private funding projects.
  • “Development of integrated Urban Microclimatic Modeling Tool – Wind and Thermal, Solar Irradiance/Shading and Acoustic Noise Mapping,” NRF-MND Land and Livability National Innovation Challenge (L2NIC), 2014 – 2017
  • “Non-Intrusive Condition Monitoring System for Railway Cables,” Industry Project, 2015 – 2016
  • “Board-level Bias Tee Study for Optical module EMI Mitigation,” Industry Project, 2015 – 2016
  • “Accurate Positioning in Urban Canyons using GPS Multipath Signal and 3D City Model,” Industry Project, 2015 - 2016
  • “Conductive Composite Laminates,”  A*STAR Aerospace Program, SERC Funding, 2012 – 2013
  • “Design Optimization of an Electromagnetic Nano-positioning Actuator,” Inter-RI Research Project, 2012-2013 
  • EPRC-11 Project: “TSV Silicon Interposer (TSI),” Industry Consortium, 2011 – 2013
  • “3D TSV (Through-silicon Via) Consortium,” A*STAR SERC PPP Funding, 2009 –2013
  • "Electromagnetic Simulator for Predicting the Electromagnetic Interference - Phase II," Industry Project, 2012
  • “Electromagnetic Simulator to Calculate Far Field Electromagnetic Interference – Phase I,” Industry Project, 2011
  • “Study/Implementation of a Frequency-Domain 2D Field Solver for Impedance Calculation on Signal Traces in Single-ended and Differential Microstrip and Stripline Configurations,”  Industry Project, 2010
  • EPRC-9 Project: “TSV Technology for Packaging of Cu Low-k Chip,” Industry Consortium, 2007 - 2009
  • “Simulation for System Level Electronic Packaging (SSLEP),” IHPC Grand Challenge Research Project, 2006 - 2009
  • EMC Consortium: “High-speed electronics design,” Industry Consortium, 2006
  • Training Course (1 week): “High-speed Electronic Design” , Course Designer and Instructor, Industry Training Project, 2006

Patents & Technology Disclosures

  • E.-P. Li, X.-C. Wei, E.-X. Liu, Z. Z. Oo, and E. K. Chua, "Method and systems for modeling signal interaction in an electronic package," International Patent (WO 2009/108137) filed on 27 Feb 2009.
  • En-Xiao Liu, Hanhua Qian, Wenzu Zhang, Wilson Choo, Wee Kee Phua, Yeoh Wai Siang, Ching Eng Png, “Method for electrical signature based fault diagnosis and prognosis of railway traction system,” Invention Disclosure, Nov. 2016.
  • Wenzu Zhang, Wilson Choo, Hanhua Qian, En-Xiao Liu, Wee Kee Phua, Ching Eng Png, “A method and system for fault detection and predictive maintenance,” Invention Disclosure, Nov. 2016.
  • XianKe Gao, Siping Gao, Hui Min Lee, C. H. Zhan, P. F. Yu, En-Xiao Liu, Ching Eng Png, “Cavity-backed U-curled Dumbbell DGS Filter Design for Gigahertz Common-mode Noise Suppression,” Invention Disclosure, Feb. 2016.
  • Poh Hee Joo, Bui Viet Phuong, Koh Wee Shing, En-Xiao Liu, Zhao Weijiang and Tan Sze Tiong, “Software Development for Urban Microclimate – Multi-physics Integrated Simulation Tool (UM-MIST),” Invention Disclosure, Dec. 2015.
  • Weijiang Zhao, Binfang Wang, En-Xiao Liu, "Methods and Systems for Predicting Radiated Emissions Based on Near-Field Scanning," Invention Disclosure (IHPC-TD-EP-2013-007), Oct. 2013.
  • E.-X. Liu, E. K. Chua, T. C. Chai, and Y. M. Khoo, "Array of through-silicon vias (TSV) for improved power integrity of advanced packaging and methods of forming," Invention Disclosure (ID-CEP-007-2009), Sept. 2009.

Professional Appointments & Membership

  • Distinguished Lecturer, IEEE EMC Society, 2017-2018
  • Guest Editor (2017-2018), IEEE Transactions on Components, Packaging and Manufacturing Technology
  • Symposium General Chair, 2018 Joint IEEE International EMC & Asia-pacific EMC Symposium, Singapore, 14-17 May 2018
  • External Examiner for PhD Thesis, The University of Hong Kong, 2016
  • PhD Supervisor, National University of Singapore, 2014-present
  • PhD Thesis Advisory Committee Member, Nanyang Technological University, 2013-present
  • Senior Member, Institute of Electrical and Electronic Engineers (IEEE) , 2009-present

Honors and Awards

  • Distinguished Lecturer (2017-2018), IEEE EMC Society
  • “Technical Achievement Award”, presented by the IEEE Electromagnetic Compatibility Society, for "outstanding contributions to the circuit-field modeling of high-speed integrated circuits, packages, and printed circuit boards", 2016
  • Best Symposium Paper Award (Co-author), 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, (APEMC) 17-21 May, 2016, Shenzhen, China, 2016
  • “Most Innovative Solution” Category, SMRT Vendors’ Day Award, 2016
  • Finalist, Best Symposium Paper Award, 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 25-29 May, 2015, Taiwan., 2015
  • Singapore Ministry of Trade Industry (MTI) Borderless Award (Silver, co-recipient), 2015
  • Top 50 papers in Fifty years of IEEE Transaction on Electromagnetic Compatibility (1964-2013) with highest average citation count per year, for paper published in vol. 52, no. 2, pp. 248-265, May 2010 (ranked as No. 11), 2014, http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6798812
  • Best Industry Project (FY12), by A*STAR IHPC, 2013
  • A*STAR Research Highlights:"Device Physics: Simulating Electronic Smog," (Jul. 2013) for the research work published in IEEE Trans. EMC, vol. 54, no. 5, 2012, http://www.research.a-star.edu.sg/research/6705, 2013
  • Best Paper Award (first author), IEEE Electrical Design of Advanced Package & Systems Symposium, Taiwan, R. O. C, Dec. 2012, 2012
  • Best Industry Project (FY11), by A*STAR IHPC, 2012
  • A*STAR Research Highlights: “Electronics: A Faster Model for Speedier Circuits” (28 March 2012), for the research work published in IEEE Trans. Compon. Packag. Technol., Sept. 2011, http://www.research.a-star.edu.sg/research/6463, 2012
  • Best-Paper-of-the-Year Award (FY09) by A*STAR IHPC, for the paper (first author) published in IEEE Trans. Microwave Theory Tech. (vol. 57, no. 7, pp. 1724-1733, Jul. 2009), 2010
  • Finalist, IES Prestigious Engineering Achievement Award, Institute of Engineers, Singapore, for project titled “A new design and simulation system for complex 3D nano-electronic packaging” (Co-principle investigator), 2009
  • Postgraduate Scholarship, National University of Singapore and Institute of High Performance Computing, A*STAR, Singapore, 2001-2004
  • Youth Innovation Award for Science and Technology (Second Prize, lead recipient), Ministry of State Power, China, 2001

Professional Services

Services to Societies

  • Chair (2009/2012/2013) and Executive Committee Member, IEEE Singapore EMC Chapter, 2007-present

Conference Committees

International Advisory/Steering Committee (IAC/ISC)

  • IAC member, 2014 Global Symposium on EMC, Safety and Product Compliance Engineering (GlobeSpace 2014), Israel, 2014
  • ISC member, IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS), Japan, Dec. 2013; Korea, Dec. 2015; Hawaii, Dec. 2016.

Technical Program Committee (TPC)

  • Technical Program Co-Chair, Asia Pacific Symposium on EMC (APEMC), 18-21 May 2016, Shenzhen, China. 
  • Technical Chair, Asia Pacific Symposium on EMC (APEMC), 21-24 May 2012, Singapore. 
  • Technical Sub-Committee Chair, Asia Pacific International Symposium on EMC, May 2013, Australia.
  • TPC member for nine more international conferences

Organizing Committee (OC)

  • General Chair, 2018 Joint IEEE International Symposium on EMC and Asia Pacific Symposium on EMC (Joint IEEE EMC & APEMC), 14-17 May, 2018 (to be held)
  • Finance Chair, 2015 IEEE 4th Asia-Pacific Conference on Antennas and Propagation (APCAP), Bali, Indonesia, 30 June-03 July, 2015
  • Organizing Chair, IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS), Singapore, 07-09 Dec., 2010
  • Chair for Special Sessions, 19th International EMC Zurich Symposium & 2008 Asia Pacific Symposium on EMC, 9-12 May 2008, Singapore.
  • OC member for five more international conferences

Journal Paper Reviewer

  • Regular reviewer for six IEEE Transactions 
  • Regular reviewer for four more international journals