Integrated Circuits and Hardware AI
Sensors, Actuators and Embedded Memory
R & D Fab
Material, Device, Reliability Analysis
WHY JOIN IME
JOBS @ IME
IME provides support to the semiconductor industry via a multi-pronged approach. Different collaboration models are available to meet target needs and R&D objectives. Companies undertaking R&D can explore expanding their scope and reach of projects by collaborating with IME via the best fit approach. The different types of partnerships include 1-on-1 research development to achieve dedicated solution, resource and cost-sharing multi-parties consortium targeting pre-competitive research , as well as strategic joint labs to accelerate innovation in specific research areas that will converge towards a common roadmap.
1-1 Joint Research Development
Joint collaboration focusing on the research and development of specific, targeted technologies or products with individual companies.
Examples of collaborations
ROHM Semiconductor and A*STAR IME to develop artificial intelligence chip for predictive maintenance in smart factories
Murata Manufacturing and A*STAR IME collaborate to advance MEMS technologies
Biospark and A*STAR IME collaborate to develop wireless implantable device for chronic pain management
Petroleum Geo-Services and A*STAR IME to develop MEMS sensor technology for oil and gas applications
Forming collaboration with multiple companies of the supply chain ecosystem, IME's consortium aims to assist members in reaching new heights in microelectronics technology. It is a resource and experience-sharing platform to conduct research and development on focus interest projects. IME’s mission is to value-add to consortia members by advancing in leading edge relevant R&D and to help members sustain growth and competitiveness by planning ahead.
Examples of consortia
Multi-chip fan-out wafer level packaging development line consortium
Micro-electro-mechanical system (MEMS) consortium Phase III
Cost-effective interposer consortium
Silicon micro cooler consortium
High density fan-out wafer level packaging consortium
2.5D through-silicon interposer consortium
Since 2011, IME has collaborated with leading industry partners on joint labs and other public-private collaborations in key areas of research including advanced packaging, assembly, lithography, metrology and MEMS. These collaborations undertake R&D to facilitate innovative semiconductor solutions to address global challenges in the semiconductor industry.
Examples of collaborations
Centre of Excellence in Advanced Packaging with Applied Materials
Launch of four semiconductor joint labs with 10 industry partners
MEMS Twin Lab with GLOBALFOUNDRIES Singapore and Masdar Institute
Technology for Enterprise Capability Upgrading (T-UP) for local Small and Medium Enterprises (SMEs)
Chong Gim Hong
Technology for Enterprise Capability Upgrading (T-UP) was launched in August 2002 by five government agencies - A*STAR, EDB, IDA and Enterprise Singapore (formerly IE Singapore and SPRING Singapore), with the aim of helping Singapore enterprises upgrade their R&D capabilities through the secondment of experienced researchers from A*STAR Research Institutes. These researchers, with their expertise and access to state-of-the-art facilities in the A*STAR institutes, can help the Singapore enterprises identify, develop and implement leading-edge technologies that can reap commercial value. At the same time, they help to train and build up the R&D human capital in the industry. Click
for more information on the T-Up program.
IME licenses its technology or Intellectual Property (IP) to industry collaborators through Exploit Technologies (ETPL). ETPL is the commercialisation arm of the Agency for Science, Technology and Research (A*STAR), supporting it in transforming the economy by driving innovation and commercialising its research outcomes.
Copyright A*STAR Institute of Microelectronics 2018