28 May 2015
Dr. Zhang Xiaowu, a researcher with IME’s Interconnect and Packaging (IPP) Programme, has received the prestigious IEEE CMPT Exceptional Technical Achievement Award 2015.
The award is presented annually by the IEEE Components, Packaging and Manufacturing Technology (CMPT) society to an individual, or a team of not more than 3, for exceptional technical achievements that advance the state-of-the-art in CPMT’s fields of interest. These encompass the scientific, engineering and production aspects of materials, component parts, modules, hybrids and micro-electronic systems for all electronic applications.
Dr. Zhang’s major contributions in the area of 2.5D / 3D integrated circuits integration, focusing primarily on micro bump solder joint reliability, process development and stress sensor technology, received recognition and acknowledgement from his peers in the field. Dr. Zhang received the award at the 65th IEEE Electronic Components Technology Conference (ECTC) in San Diego, California, USA on 28 May 2015.