6 December 2018
A paper by IME's researchers and engineers, Ms Sharon Lim-Pei Siang, Dr Ding Mian Zhi and Dr Kawano Masaya (Heterogeneous Integration Group) presented at at the 19th Electronics Packaging Technology Conference (EPTC 2017), was selected as the Best Interactive Paper. The paper, "Chip-to-Wafer (C2W) flip chip bonding for 2.5D High Density Interconnection on TSV Free Interposer" brought into focus the technical challenges in chip to wafer bonding and underfill dispensing process for test dies with high I/Os onto a TSV free interposer (TFI). It also highlighted optimized C2W assembly process enabling 100% electrical bump connection without underfill voids for both large GPU die and HBM die with irregular bump layout. Ms Sharon Lim, 1st author, was presented with the award at EPTC 2018 on 6 December 2018 at Resorts World Sentosa, Singapore.