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4 October 2011

Peng Lan, an attachment student at A*STAR Institute of Microelectronics (IME) has bagged a bronze medal at the 5th Taiwan Semiconductor Manufacturing Co. (TSMC) Outstanding Student Research Award, Electronic Device, Process and Patterning Technologies category, on 4th October 2011. His winning paper, “Fine pitch Cu-Cu bonding technology for 3D IC stacking”, is a student project done in IME supported by Nanyang Technological University, Singapore (NTU).

Peng Lan (second from right, in picture, with contestants of the final competition and university professors) is a third year Electrical and Electronic Engineering PhD student at the NTU. He is currently on attachment to IME’s Through Silicon Via programme supervised by IME’s Dr. Patrick Lo, Dr. Li Hong Yu, and Assistant Professor Tan Chuan Seng of NTU.

The TSMC Outstanding Student Research Award recognizes exceptional semiconductor-related researches carried out by graduate students. The award focuses on experimental or first-principle researches oriented to technology advancement as well as fundamental understandings. Into its 5th year, the award attracts submissions from elite universities including Massachusetts Institute of Technology (MIT), Cornell University, University of Illinois at Urbana-Champaign (UIUC), Stanford University, University of California, Berkeley (UC Berkeley), Georgia Institute of Technology (Georgia Tech) and Oxford University.