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AWARDS

9 December 2010

IME's conference paper was presented with Outstanding Paper Award at the 12th Electronics Packaging Technology Conference (EPTC) held in Shangri-La Hotel, Singapore. The paper titled "Effect of TSV interposer on the thermal performance of FCBGA package" by Ms Germaine Hoe and team described the use of compact modeling to study the effects of various TSV parameters on the equivalent thermal conductivity of TSV interposer. Results reported provided insights to improving thermal path of the packages for better thermal performance.