30 May 2006

IME presented a total of 17 papers at the 56th Electronics Components and Technology Conference (ECTC) held in San Diego from 30 May - 2 June. The topics included 3D interconnects, drop impact, wafer level packaging, MEMS packaging and bio-fluidic package, reflecting IME's wide scope of research in packaging technologies.

ECTC is the premier international packaging, components and microelectronic systems technology conference. This year's conference consisted of 38 technical sessions, 16 professional development courses and a technology corner with over 70 exhibitors.

Papers by IME researchers have also been accepted at upcoming conferences such as:

  • Radio Frequency Integrated Circuit Conference 2006, 11 - 13 June 2006, San Francisco, USA (7 papers accepted
  • 36th Eurosensors, 17 - 20 September 2006, Goteborg, Sweden (6 papers accepted)
  • 32rd European Solid-State Circuits Conference (ESSCIRC), 18 - 22 September 2006, Montreux, Switzerland (2 papers accepted)
  • 10th International Conference on Miniaturized Systems for Chemistry and Life Sciences (�TAS2006), 5 - 9 November 2006, Tokyo, Japan (8 papers accepted)

In addition, IME’s works were recently recognized in prestigious journals such as IEEE Electron Device Letters, Applied Physics Letters, Sensors and Actuators, and Lab on a Chip.