Publications

Title of PublicationAuthor(s)Name of Journal / Conference
Co-design for extreme large package solution with embedded fine pitch interposer (EFI) technologyChe Faxing, David Ho, Chai Tai Chong2018 IEEE 68th Electronic Components and Technologies Conference (ECTC 2018),San Diego, California USA, (29 May to 01 Jun 2018) DOI 10.1109/ECTC.2018.00158
3D System-on-Packaging Using Through Silicon via on SOI for High-Speed Optical Interconnections with Silicon Photonics Devices for Application of 400 Gbps and BeyondKim Dowon, Li Hong Yu, Chang Ka Fai, Loh Woon Leng, Chong Ser Choong, Cai Hong and Surya Bhattacharya2018 IEEE 68th Electronic Components and Technologies Conference (ECTC 2018), San Diego, California USA, (29 May to 01 Jun 2018) DOI 10.1109/ECTC.2018.00129
Electrical design for the development of FOWLP for HBM integrationLim Teck Guan, David Ho Soon Wee2018 IEEE 68th Electronic Components and Technologies Conference (ECTC 2018), San Diego, California USA, (29 May to 01 Jun 2018) DOI 10.1109/ECTC.2018.00321
High Density TSV-Free Interposer (TFI) Packaging with Submicron Cu damascene RDLs for Integration of CPU/GPU and HBMMasaya Kawano, Wang Chunmei, Li Hong Yu, Ding Mian Zhi, Sharon Lim Pei Siang, Lim Teck Guan, Chen Zihao, Che Faxing2018 IEEE 68th Electronic Components and Technologies Conference (ECTC 2018), San Diego, California USA, (29 May to 01 Jun 2018) DOI 10.1109/ECTC.2018.00282
Development of WLCSP for Accelerometer Packaging with Vertical CuPd Wire as Through Mold Interconnection (TMI)Chen Zhaohui, Lau Boon Long, Ding Zhipeng, Ding Mian Zhi, Eva Wai Leong Ching, Han Beibei, Bu Lin, Chang Hyun Kee, Chai Tai Chong2018 IEEE 68th Electronic Components and Technologies Conference (ECTC 2018), San Diego, California USA, (29 May to 01 Jun 2018) DOI 10.1109/ECTC.2018.00183
Process development of 4-die stack module using Moldable UnderfillChong Ser Choong, Li Hong Yu, Xie Ling, Simon Lim, Chen Zhaohui2018 IEEE 68th Electronic Components and Technologies Conference (ECTC 2018), San Diego, California USA, (29 May to 01 Jun 2018) DOI 10.1109/ECTC.2018.00347
Novel Microwave process for RDL Photosensitive Dielectric Polymer curing on FOWLP reconstructed waferKazunori Yamamoto, Wang Chunmei, Wang Xiangyu, Tuck Foong Koh (AMAT), Felix Deng (AMAT)2018 IEEE 68th Electronic Components and Technologies Conference (ECTC 2018), San Diego, California USA, (29 May to 01 Jun 2018) DOI 10.1109/ECTC.2018.00152
Thermal Design and Characterization of High Power SiC Inverter with Low Profile and Enhanced Thermal PerformanceTang Gongyue, Chai Tai Chong, Zhang Xiaowu2018 IEEE 68th Electronic Components and Technologies Conference (ECTC 2018), San Diego, California USA, (29 May to 01 Jun 2018) DOI 10.1109/ECTC.2018.00293
Millimeter-wave antenna in fan-out wafer level packaging for WL60 GHz WLAN applicationChen Zihao, Lim Teck Guan, David Soon Wee Ho, Surya Bhattacharya2018 IEEE 68th Electronic Components and Technologies Conference (ECTC 2018), San Diego, California USA, (29 May to 01 Jun 2018) DOI 10.1109/ECTC.2018.00057
Development of Integrated Thermistor Sensor and Heating Electrode for Renal Denervation ProcedureLim Ruiqi, Cheng Ming-Yuan, Chen Weiguo, David Sze Wai Choong (Handok), Park Jae Hyung(Handok), Oh Jung Soo(Handok), Sebastian Song(Handok), Park Eul Joon(Handok), Alex Gu Yuandong2018 IEEE 68th Electronic Components and Technologies Conference (ECTC 2018), San Diego, California USA, (29 May to 01 Jun 2018)
Cost-Effective Testing Solutions for Sealing Material with IR PackageBu Lin, Jason Au Keng Yuen, Ding Mian Zhi, Vivek Chidambaram, Chuan Kailiang (Excelitas) and Ng Foo Wing (Excelitas)IEEE Transactions on Components, Packaging and Manufacturing Technology (IEEE CPMT), Vol 8, No. 9 September 2018, Published on 31 August 2018, DOI#10.1109/TCPMT.2018.2817251
Biopackaging of minimally invasive ultrasound assisted clot lysis device for stroke treatmentMaria Ramona Damalerio, Cheng Ming-Yuan, Chen Weiguo, Lou Liang and Zhang SongsongElectronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.67
Simulation analysis of a conformal patch sensor for skin tension and swelling detectionLim Ruiqi, Cheng Ming-Yuan, Maria Ramona Damalerio and Cheng WeiguoElectronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.102
Co-design for low warpage and high reliability in advanced package with TSV-free interposer (TFI)Che Faxing, Masaya Kawano, Ding Mian Zhi, Han Yong and Surya BhattacharyaElectronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.31
Electrical Characterization of CMP-less Via-Last TSV under Reliability Stress ConditionsChui King Jien, Yu MingbinElectronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.268
A Novel Method for Air-gap Formation around Via-Middle (VM) TSVs for Effective Reduction in Keep-Out Zones (KOZ)
Chui King Jien, Loh Woon Leng, Wang Xiangyu, Chen Zhaohui, Yu MingbinElectronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.238
Passive Devices Fabrication on FOWLP and Characterization for RF ApplicationWang Chunmei, Chui King Jien, Wang Xianyu, Lim Teck Guan, Yu Mingbin, Gu Yu (AMAT), Gilbert See (AMAT)Electronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.315
Package-level Si Micro-fluid Cooler with Enhanced Jet Array for High Performance 3D SystemsHan Yong, Lau Boon Long, Tang Gongyue, Low Seow Meng (BeCe), Jason Goh (BeCe)Electronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.42
Extremely High Temperature and High Pressure (x-HTHP) Endurable Multiple SOI Device & Sensor Packaging for Harsh Environment ApplicationsJason Au Keng Yuen, Che Faxing, Eva Wai Leong ChingElectronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.30
Process and Reliability of Large Fan Out Wafer Level Package based Package-on-Package for Mobile ApplicationsVempati Srinivasa Rao, Chai Tai Chong, David Ho, Ding Mian Zhi, Chong Ser Choong, Sharon Lim PS, Daniel Ismael and Ye Yong LiangElectronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.122
Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on PackageChen Zhaohui, Che Faxing, Ding Mian Zhi, David Ho Soon Wee, Chai Tai Chong, Vempati Srinivasa RaoElectronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.201
Study on Low Warpage and High Reliability for Large Package using TSV-Free Interposer Technology through SMART Co-Design ModellingChe Faxing, Masaya Kawano, Ding Mian Zhi, Han Yong and Surya BhattacharyaIEEE Transactions on Components, Packaging and Manufacturing Technology (IEEE CPMT), VOL. 7, NO. 11, Pages 1774-1785, NOVEMBER 2017. DOI#10.1109/TCPMT.2017.2707567
Heat Dissipation Enhancement of 2.5D Package with 3D Graphene & 3D Boron Nitride Networks as Thermal Interface material (TIM)Manuela Loeblein (IME/NTU), Tsang Siu Hon (NTU), Han Yong, Zhang Xiaowu, Edwin Hang Tong Teo (NTU)66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.85)
Comprehensive Investigation of Die Shift in Compression Molding Process for 12 Inch Fan-Out Wafer Level PackagingHan Yong, Ding Mian Zhi, Bu Lin, Chong Ser Choong66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.46)
Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu BondpadJason Au Keng Yuen, Che Faxing, Lin Jong-Kai, Hsiao Hsiang-Yao, Zhang Xiaowu, Sharon Lim Seow Huang, Aw Jie Li, Alvin Chow (UTAC)66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.127)
Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile ApplicationsVempati Srinivasa Rao, Chai Tai Chong, David Ho, Ding Mian Zhi, Chong Ser Choong, Sharon Lim, Daniel Ismael and Ye Yong Liang66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.203)
3D Silicon Photonics Packaging Based on TSV Interposer for High Density On-Board Optics ModuleYan Yang (IME/NTU), Yu Ming Bin, Fang Qing, Song Junfeng, Tu Xiaoguang, Patrick Lo Guo-Qiang, Rusli (NTU)66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.89)
A Cost-Effective, CMP-Less, Via-Last TSV Process for High Denisty RDL ApplicationsChui King Jien, Loh Woon Leng, Wang Chunmei, Chang Ka-Fai, Ren Qin, Gilho Hwang, Chua Hung-Ming, Yu Mingbin66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.200)
Miniaturized Double Side Cooling Packaing for High Power 3 Phase SiC Inverter Module with Junction Temperature over 220°CDaniel Rhee Min Woo, Hwang How Yuan, Jerry Aw Jie Li, Lee Jong Bum, Zhang Hengyun66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.396)
Study on Process Induced Wafer Level Warpage of Fan-Out Wafer Level PackagingChe Fa Xing, David Ho Soon Wee, Ding Mian Zhi, Daniel Rhee Min Woo66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.115)
Development and reliability evaluation of large scale thin TSV die stacking on waferLee Jong Bum, Chong Ser Choong, Au Keng Yuen, Rhee Min Woo66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.316)
Assembly Processs and Warpage Management of Large Size Through Silicon Intreposer (38.7mm x 26.7mm) PackageChen Zhaohui, Lin Jong-Kai, Ding Mian Zhi, Sharon Lim Pei Siang, Zhang Xiaowu66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.151)
Biopackaging of Intracranial Pressure Microsystem for Multimodality Neuro Monitoring of Severe Head Injury PatientsRamona Damalerio, Tan Kwan Ling, Lim Ruiqi, Chen Weiguo, Gao Yuan, Xue Ning, Cheng Ming-Yuan, Jai Prashanth Rao (NNI)66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.158)
Wearable Sensor Patch for Early Extravastion DetectionCheng Ming-Yuan, Ramona Damalerio, Lim Ruiqi, Chen Weiguo, Tan Kwan Ling, Choon Looi Bong and Tan Swee Kim66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.82)
Forward Tactile Sensing Device Development and Biopackaging for Endovasular Guidewire Intervention ApplicationLim Ruiqi, Tan Ee Lim, Chen Weiguo, Tan Kwan Ling, Ramona Damalerio, Cheng Ming-Yuan, Benjamin Chua Soo Yeng (NUS), Melvin Loh Wee Chuan (NUS), Rachel Hong Tsui Ying (NUS)66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.143)
3D Electro-Optical Integration Based on High-Performance Si Photonics TSV InterposerYu Mingbin, Yan Yang, Fang Qing, Tu Xiaoguang, Song Junfeng, Chui King-Jien, Rusli and Patrick Lo Guo-QiangOptical Fiber Communication Conference (OFC 2016) 20-24 March 2016, Anaheim Convention Center, Anaheim, California, USA (Th3J.3 • 13:45)
Design Optimization and Characterisation of silicon micro-cooler system through finite element modeling and experimental analysesChe Fa Xing, Yong Han, Boon Long Lau, Xiaowu ZhangIEEE Transactions on Components, Packaging and Manufacturing Technology (IEEE CPMT), VOL. 6, NO. 2, FEBRUARY 2016 DOI#10.1109/TCPMT.2015.2511785
Development of a Compact and Efficient liquid Cooling System with Silicon Micro-Cooler for High power Microelectronic DevicesTang Gong Yue, Han Yong, Lau Boon Long, Zhang Xiaowu, and Daniel Rhee Min WooIEEE Transactions on Components, Packaging and Manufacturing Technology (IEEE CPMT), VOL. 6, NO. 5, 13 MAY 2016, DOI#10.1109/TCPMT.2016.2542848
3-D Modeling and Characterization for Die Attach ProcessBu Lin, Eva Wai Leong Ching, Ho Siow Ling, Rhee Min Woo, Yong Puay FenIEEE Transactions on Components, Packaging and Manufacturing Technology (IEEE CPMT), VOL. 6, NO. 10, Published 13 Oct 2016, DOI#10.1109/TCPMT.2016.2606112
3-D TSV Six-Die Stacking and Reliability Assessment of 20-μm-Pitch Bumps on Large-Scale DiesLee Jong Bum, Aw Jie Li and Rhee Min WooIEEE Transactions on Components, Packaging and Manufacturing Technology (IEEE CPMT)y, VOL. 7, NO. 1, Published 10 JANUARY 2017, DOI#10.1109/TCPMT.2016.2628372
Si-based Hybrid Micro-Cooler with Multiple Drainage Micro-Trenches for High Heat Flux CoolingHan Yong, Lau Boon Long, Tang Gongyue, Zhang Xiaowu, Daniel Rhee MinwooIEEE Transactions on Components, Packaging and Manufacturing Technology (IEEE CPMT), VOL. 7, NO. 1, Publish 10 JANUARY 2017, DOI#10.1109/TCPMT.2016.2627040
Failure Mechanism for fine pitch micro bump on Cu/Sn/Cu system during Current StressingHsiao Hsiang Yao, Alastair David Trigg, Chai Tai ChongIEEE Transactions on Components, Packaging and Manufacturing Technology (IEEE CPMT), VOL. 5, NO. 3, MARCH 2015 DOI: 10.1109/TCPMT.2015.2398416
Package-Level Micro-Jet Based Hotspot Cooling Solution for Microelectronic DevicesHan Yong, Lau Boon Long and Zhang XiaowuIEEE Electron Device Letters (EDL) VOL. 36, NO. 5, MAY 2015 DOI#10.1109/LED.2015.2417152
Design and Optimization of Wafer Level Compression Molding Process for One Chip Plus Multiple DecapsLin Bu, Siowling Ho, Sorono Dexter Velez, Lau Boon Long, Booyang Jung, Taichong Chai, Xiaowu ZhangIEEE Transactions on Components, Packaging and Manufacturing Technology (IEEE CPMT), VOL. 5, NO. 5, MAY 2015 DOI#10.1109/TCPMT.2015.2424274
Heat Dissipation Capability of a Package-On-Package Embedded Wafer-Level PackageHan Yong, Lau Boon Long, Jung Boo Yang, Zhang XiaowuIEEE Design & Test July/August Issue, Published: 9 June 2015, DOI#10.1109/MDAT.2015.2440414
Fabrication & Assembly of Cu-RDL based 2.5D Low Cost Through Silicon Interposer (LC-TSI)Guruprasad Katti, David Ho Soon Wee, Li Hong Yu, Zhang Songbai, Rahul Dutta, Roshan Weerasekera, Chang Ka Fai, Lin Jong-Kai, Srinivasa Rao Vempati and Surya BhattacharyaIEEE Design & Test Volume: 32, Issue: 4, Pages 23-31, Published 20-Apr-15, DOI# 10.1109/MDAT.2015.2424429
Heterogeneous 2.5D Integration on Through Silicon InterposerXiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Songbai Zhang, Roshan Weerasekera. Rahul Dutta, Ka Fai Chang, King Jien Chui, Hong Yu Li, David Soon Wee Ho, Liang Ding, Guruprasad Katti, Suryanarayana Bhattacharya, Dim-Lee KwongApplied Physics Review 2, 021308 (2015), pages 021308- 1-58, Published June 2015, DOI#10.1063/1.4921463
Stress Analysis and Design Optimization for Low-k Chip with Cu Pillar InterconnectionChe Fa Xing, Lin Jong-Kai, Au Keng Yuen Jason, Hsiao Hsiang-Yao, Zhang XiaowuIEEE Transactions on Components, Packaging and Manufacturing Technology (IEEE CPMT), VOL. 5, NO. 9, SEPTEMBER 2015, DOI#10.1109/TCPMT.2015.2461020
Thermal Management of Hotspots Using Diamond Heat Spreader on Si Micro-Cooler for GaN DevicesHan Yong, Lau Boon Long, Tang Gongyue and Zhang XiaowuIEEE Transactions on Components, Packaging and Manufacturing Technology (IEEE CPMT), VOL. 5, NO. 12, DECEMBER 2015, DOI#10.1109/TCPMT.2015.2480077
Synthesis of Inline Mixed Coupled Quasi-Elliptic Bandpass Filters Based on λ/4 ResonatorsZhang Songbai, Zhu Lei, Roshan WeerasekeraIEEE Transactions on Microwave Theory and Techniques (TMTT), VOL. 63, NO. 10, OCTOBER 2015, DOI#10.1109/TMTT.2015.2467380