Publications

Title of PublicationAuthor(s)Name of Journal / Conference
Stealth Dicing Challenges for MEMS Wafer ApplicationDaniel Ismael Cereno, Sunil WickramanayakaElectronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.132
Development of TSV electroplating process for via-last technologyHwang Gilho, Ravanethran KalaiselvanElectronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.219
Forming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging (FOWLP)Leong Yew Wing, Hsiao Hsiang-Yao, David Soon Wee Ho, Lau Boon Long, Lin HuamaoElectronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.342
Study of C2W Bonding Using Cu Pillar with Side-wall Plated SolderXie Ling, Sunil Wickramanayaka, Vasarla Nagendra Sekhar and Daniel Ismael CerenoElectronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.260
Study of line-space pitch multiplication using graphoepitaxy directed self-assembly for semiconductor applicationsWang Shi Jie, Deng Wei, Seow Yong Ann, Chen Bing, Lin Qun YingJournal Of Electronic Materials, Vol. 46, No. 7, 2017, DOI: 10.1007/s11664-017-5431-y, 2017 The Minerals, Metals & Materials Society
MEMS industry-worth etching to fabricate tapered structures in SiO2Vladimir Bliznestsov, Li Bin, Lee Jae-Wung and Lin HuamaoJournal of Microelectromechanical System (JMS), Publish 04 Oct 2017, DOI#10.1109/JMEMS.2017.2755046
6um Pitch High Density Cu-Cu bonding for 3D IC StackingXie Ling, Sunil Wickramanayaka, Chong Ser Choong, Vasarla Nagendra Sekhar, Daniel Ismael, Ye Yong Liang66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.141)
High-throughput Thermal Compression Bonding of 20 um Pitch Cu Pillar with Gas Pressure Bonder for 3D IC StackingXie Ling, Sunil Wickramanayaka, Chong Ser Choong, Vasarla Nagendra Sekhar, Daniel Ismael Cereno66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.343)
Al-Ge Diffusion Bonding for Hermetic Sealing ApplicationVivek Chidambaram, Sunil WickramanayakaJournal of ELECTRONIC MATERIALS, Vol. 44, No. 7, Pages 2387-2395, Published 6-Mar-15, DOI: 10.1007/s11664-015-3683-y
Deep SiO2 etching with Al and AlN masks for MEMS devicesVladimir Bliznetsov, Hua Mao Lin, Yue Jia Zhang and David Johnson (SPTS)Journal of Micromechanics and Microengineering (JMM), 25 (2015) 087002 (8pp), Published Jul 2015, DOI#10.1088/0960-1317/25/8/087002