PUBLICATIONS_Header

Title of Publication Author(s) Name of Journal / Conference
Stealth Dicing Challenges for MEMS Wafer Application Daniel Ismael Cereno, Sunil Wickramanayaka Electronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.132
Development of TSV electroplating process for via-last technology Hwang Gilho, Ravanethran Kalaiselvan Electronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.219
Forming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging (FOWLP) Leong Yew Wing, Hsiao Hsiang-Yao, David Soon Wee Ho, Lau Boon Long, Lin Huamao Electronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.342
Study of C2W Bonding Using Cu Pillar with Side-wall Plated Solder Xie Ling, Sunil Wickramanayaka, Vasarla Nagendra Sekhar and Daniel Ismael Cereno Electronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.260
Study of line-space pitch multiplication using graphoepitaxy directed self-assembly for semiconductor applications Wang Shi Jie, Deng Wei, Seow Yong Ann, Chen Bing, Lin Qun Ying Journal Of Electronic Materials, Vol. 46, No. 7, 2017, DOI: 10.1007/s11664-017-5431-y, 2017 The Minerals, Metals & Materials Society
MEMS industry-worth etching to fabricate tapered structures in SiO2 Vladimir Bliznestsov, Li Bin, Lee Jae-Wung and Lin Huamao Journal of Microelectromechanical System (JMS), Publish 04 Oct 2017, DOI#10.1109/JMEMS.2017.2755046
6um Pitch High Density Cu-Cu bonding for 3D IC Stacking Xie Ling, Sunil Wickramanayaka, Chong Ser Choong, Vasarla Nagendra Sekhar, Daniel Ismael, Ye Yong Liang 66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.141)
High-throughput Thermal Compression Bonding of 20 um Pitch Cu Pillar with Gas Pressure Bonder for 3D IC Stacking Xie Ling, Sunil Wickramanayaka, Chong Ser Choong, Vasarla Nagendra Sekhar, Daniel Ismael Cereno 66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.343)
Al-Ge Diffusion Bonding for Hermetic Sealing Application Vivek Chidambaram, Sunil Wickramanayaka Journal of ELECTRONIC MATERIALS, Vol. 44, No. 7, Pages 2387-2395, Published 6-Mar-15, DOI: 10.1007/s11664-015-3683-y
Deep SiO2 etching with Al and AlN masks for MEMS devices Vladimir Bliznetsov, Hua Mao Lin, Yue Jia Zhang and David Johnson (SPTS) Journal of Micromechanics and Microengineering (JMM), 25 (2015) 087002 (8pp), Published Jul 2015, DOI#10.1088/0960-1317/25/8/087002