| Title of Publication | Author(s) | Name of Journal / Conference |
| Wafer-Level Vacuum-Packaged Piezoelectric Energy Harvesters Utilizing Two-Step Three-Wafer Bonding | Wang Nan, Siow Li Yan, Lionel Wong You Liang, Sun Chengliang, Ji Hongmiao, I Made Darmayuda, Peter Chang, Zhang Qingxin, Alex Gu Yuandong | Electronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.108 |
| High Vacuum and High Robustness Al-Ge Bonding for Wafer Level Chip Scale Packaging of MEMS Sensors | Xu Jinghui, Ding Zhipeng, Vivek Chidambaram, Ji Hongmiao, Alex Gu Yuandong | Electronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.228 |
| High-Band AIN Based RF-MEMS Resonator for TSV Integration | Wang Nan, Zhu Yao, Sun Chengliang, Yu Mingbin, Chua Gengli, Merugu Srinivas, Navab Singh, Alex Gu Yuandong | Electronic Components and Technology Conference (ECTC 2017) Florida USA 30 May - 02 June 2017 DOI 10.1109/ECTC.2017.220 |
| Hybrid Photonic Cavity with Metal-Organic Framework Coatings for the Ultra-Sensitive Detection of Volatile Organic Compounds with High Immunity to Humidity | Tao Jifang, Wang Xuerui (NUS), Sun Tao, Cai Hong, Wang Yuxiang (NUS), Lin Tong (NUS), Fu Dongliang, Lennon Lee Yao Ting, Alex Gu Yuandong, Prof. Zhao Dan (NUS) | Nature Scientific Report, Published: 31 January 2017, 7:41640, DOI: 10.1038/srep41640 |
| A dual-mass fully decoupled MEMS gyroscope with wide bandwidth and high linearity | Wu Guoqiang, Chua Geng Li, Alex Gu Yuandong | Sensors and Actuators A, 0924-4247/©2017 Elsevier B.V, Published 25 Mar 2017, http://dx.doi.org/10.1016/j.sna.2017.03.027
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| Torsional Frequency Mixing and Sensing in Optomechanical Resonators | Huang Jian Guo (XJU/NTU/IME), Cai Hong, Alex Gu Yuandong, Chin Lip Ket (NTU), Wu Jiu Hui (Xi'an), Chen Tian Ning (XJU), Yang Zheng Chuan (PU), Hao Yi Long (PU), Liu A Qun (NTU) | Applied Physics Letters (APL) 111, 111102 (2017), Published 12 Sep 2017, DOI#http://dx.doi.org/10.1063/1.4986811 |
| Dual MEMS Resonator Structure for Temperature Sensor Applications | Humberto Campanella, Margarita Narducci, Srinivas Merugu, Navab Singh | IEEE Transactions on Electron Devices, Year: 2017, Volume: 64, Issue: 8, Pages: 3368 - 3376, DOI: 10.1109/TED.2017.2708129, IEEE Journals & Magazines |
| ScAlN based LCAT Mode Resonators above 2GHz with High FOM and Reduced Fabrication Complexity | Zhu Yao, Wang Nan, Chua Gengli, Sun Chengliang, Navab Singh and Alex Gu Yuandong | IEEE Electron Device Letters, Vol 38, No. 10, Published Oct 2017, DOI#10.1109/LED.2017.2747089 |
| Hermetic Wafer Level Thin Film Packaging for MEMS | Jeffrey Bo Woon Soon, Navab Singh, Enes Calayir (CMU), Gary K. Fedder (CMU), Gianluca Piazza (CMU) | 66th Electronic Component and Technology Conference (ECTC 2016), Las Vegas, NV, 31 May - 3 June 2016 (DOI 10.1109/ECTC.2016.317) |
| A Passively Temperature-Compensated Dual-Frequency ALN-ON-SILICON Resonator for Accurate Pressure Sensing | Xie Qingyun, Wang Nan, Sun Chengliang, Andrew B. Randles, Pushpapraj Singh, Zhang Xiaolin and Alex Gu Yuandong | 30th International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2017) 22-26 Jan 2017 Las Vegas USA Paper#T-161 |
| High Q Low Impedance WLCSP Resonator for SUB-100 MHz Programmable Oscillator Application | Wu Guoqiang, Xu Jinghui, Zhang Xiaolin, Wang Nan, Yan Danlei, Jayce Lim Lay Keng, Zhu Yao, Li Wei and Alex Gu Yuandong
| 30th International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2017) 22-26 Jan 2017 Las Vegas USA Paper#W-144 |
| ALN Wideband Engery Harvesters with Wafer-level Vacuum Packaging Utilizing Three-Wafer Bonding | Wang Nan, Siow Li Yan, Ji Hongmiao, Peter Chang, Zhang Qingxin, Sun Chengliang, Alex Gu Yuandong
Sun Chengliang | 30th International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2017) 22-26 Jan 2017 Las Vegas USA Paper#W-126 |
| A Novel Low-Light-Level Optical Switch By Using Nano-Opto-Mechanics Technology | Tao Jifang, Cai Hong, Lennon Lee Yao Ting, Alex Gu Yuandong | 30th International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2017) 22-26 Jan 2017 Las Vegas USA Paper#W-150 |
| GHz spurious mode free AlN lamb wave resonator with high figure of merit using one dimensional phononic crystal tethers | Guoqiang Wu,Srinivas Merugu, Nan Wang, Yao Zhu, Chengliang Sun, and Yuandong Gu | Applied Physics Letters, 109, 013506, Published 8 July 2016, doi: 10.1063/1.4955410 |
| Methods for precisely controlling the residual stress and temperature coefficient of the frequency of a MEMS resonator based on an AlN cavity silicon-on-insulator platform | Wang Nan, Xu Jinghui, Zhang Xiaolin, Wu Guoqiang, Zhu Yao, Li Wei, Alex Gu Yuandong | Journal of Micromechanics and Microengineering (JMM) 26 (2016) 074003 (10pp), Published 20 May 2016, doi:10.1088/0960-1317/26/7/074003 |
| An ultrahigh-accuracy Miniature Dew Point Sensor based on an Integrated Photonics Platform | Jifang Tao, Luo Yu (NTU), Li Wang (NMC), Cai Hong, Sun Tao, Junfeng Song, Liu Hui (NMC) and Alex Gu Yuandong | Nature Scientific Report,6:29672, Published 15 July 2016, DOI: 10.1038/srep29672 |
| AlN-on-SOI platform-based Micro-Machined hydrophone | Jinghui Xu, Xiaolin Zhang, Sanchitha N. Fernando, Kevin TshunchuanChai and Alex Gu Yuandong | Applied Physics Letters,109, 032902 (2016), Published 19 July 2016, doi: 10.1063/1.4959078 |
| A High Coupling Coefficient 2.3GHz AlN Resonator for High Band LTE Filtering Application | Zhu Yao, Wang Nan, Sun Chengliang, Srinivas Merugu, Navab Singh, and Alex Gu Yuandong | IEEE Electron Device Letters (EDL), VOL. 37, NO. 10, OCTOBER 2016, DOI#10.1109/LED.2016.2602852 |
| Effectiveness of Oxide Trench Array as a Passive Temperature Compensation Structure in AlN-on-Silicon Micromechanical Resonators | Xie Qingyun, Wang Nan, Sun Chengliang, Andrew Randles, Pushpapraj Singh, Zhang Xiaolin Zhang, and Alex Gu Yuandong | Applied Physics Letters, 110, 083501 (Published 21-Feb-2017); doi: 10.1063/1.4976808 |
| ALN-ON-SOI Platorm-Based MEMS Hydrophone with ultra-low operation frequency and ultra high noise resolution | Xu Jinghui, Zhang Xiaolin, Sanchitha Feranando, Srinivas Merugu, Alex Gu Yuandong, Anders Mattson (PGS), Rune Tenghamn (PGS), Fred Barr (PGS) | IEEE MEMS 2016, Shanghai, 24-26 Jan 2016 (#0259) (M-211) |
| A Novel Miniaturized Photonic Dew-Point Hygrometer with Ultra-High Accuracy | Tao Jifang, Cai Hong, Sun Tao, Alex Gu Yuandong | IEEE MEMS 2016, Shanghai, 24-26 Jan 2016 (#0163) W-162 |
| Cavity attributing to fast release in Thin Film Encapsulation of MEMS device fabricated on smart SOI wafer | Jae-Wung Lee, Jaibir Sharma, Margarita Sofia Narducci, Srinivas Merugu, Zhang Xiao Lin and Navab Singh | Journal of Micromechanics and Microengineering (JMM), Published 15 May 2015 doi:10.1088/0960-1317/25/6/065010 |
| A Robust Bilayer Cap in Thin Film Encapsulation | Jaibir Sharma, Jae-Wung Lee, Srinivas Merugu and Navab Singh | IEEE Transactions on Components, Packaging and Manufacturing Technology (IEEE CPMT), VOL. 5, NO. 7, JULY 2015, DOI#10.1109/TCPMT.2015.2402296 |
| Demonstration of a Photonic-based Linear Temperature Sensor | Tao Jifang, Cai Hong, Alex Gu Yuandong, Wu Jian (BUPT), Liu Aiqun (NTU) | IEEE Photonics Technology Letters (PTL),VOL. 27, NO. 7, APRIL 1, 2015, DOI#10.1109/LPT.2015.2392107 |
| Methods for improving Electromechanical Coupling Coefficient in Two Dimensional Electric Field Excited AIN Lamb Wave Resonators | Sun Chengliang, Soon Bo Woon, Zhu Yao, Wang Nan, Samuel Loke Pei Hao, Mu Xiaojing, Tao Jifang and Alex Gu Yuandong | Applied Physics Letters (APL) 106, 253502 (2015), Published June 2015, DOI#10.1063/1.4923207 |
| Diaphragm shape effect on the sensitivity of surface acoustic wave (SAW) based pressure sensor for harsh environment | Wang Tao (IME/NUS), Mu Xiaojing, Andrew Brenson Randles, Alex Gu Yuandong and Lee Chengkuo (NUS) | Applied Physics Letters (APL) 107, 123501 (2015); Published Sep 2015, doi: 10.1063/1.4931363 |
RF-Designed High-Power Lamb-Wave
Aluminum–Nitride Resonators | Humberto Campanella, Margarita Narducci, Nan Wang, Jeffrey Bo Woon Soon | IEEE Transactions on Microwave Theory and Techniques (MTT),VOL. 63, NO. 2, Published -FEBRUARY 2015, DOI; 10.1109/TMTT.2014.2381244 |