A Subharmonic Up-Conversion Mixer for System-on-Package Application

Millimeterwave applications offer the promise of high-speed and high-performance in short-haul data communications. System-on-package enables a low-cost alternative to move passive components from chip onto package. This paper describes a subharmonic mixer designed on a 3-layer thin-film substrate. The mixer demonstrated low loss in converting intermediate frequency (IF) signals to 273 GHz, thus providing a viable low-cost approach to realise front-end passive components of radiofrequency (RF) transceiver for millimetre-wave applications.


1.    Rui Li et. al., “A 273 GHz 2X Subharmonic Up-Conversion Mixer for System-on-Package (SOP) Application”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, No. 12, Pg 1980 - 1984, 2012