A Thermal Isolation Technique for Three-Dimensional ICs

Heat dissipation is a key challenge in the use of through-silicon-vias (TSV) for realising 3-D integrated circuits (ICs). This paper describes a heat isolation mechanism using a TSV-based guard ring to mitigate against thermal coupling effects. Results demonstrated that the mechanism is feasible for application in highly integrated 3-D ICs present in antennas and 3-D stacked memories.
Reference:
1.    Sanming Hu et. al., “A Thermal Isolation Technique Using Through-Silicon Vias for Three-Dimensional ICs”, IEEE Transactions on Electron Device, Vol. 60, No. 3, Pg 1282 - 1287, 2013