Microtechnology: An Alignment Assignment

IME researchers have developed a novel two-wafer approach for integrating optical microelectromechanical system (MEMS) devices and photonics devices on a silicon substrate. The difficulty in aligning these two types of devices co-axially limits the conventional one-wafer approach for integration. With the two-wafer approach, two partially processed wafers are bonded first, followed by additional processing steps. In doing so, the respective optical axis of the MEMS and optical devices can align on the same plane with high precision – optical coupling loss controlled to <3 dB from 7 dB. The proposed technique can be applied to hybrid integration of silicon photonics integrated circuits and optical MEMS components with reconfiguration functions on silicon substrate.