Integrated Circuits and AI Hardware
Sensors, Actuators and Embedded Memory
R & D Fab
Material, Device, Reliability Analysis
Semiconductor Processing: Stress Management
IME researchers have designed, fabricated and calibrated piezoresistive stress sensors to measure the amount of mechanical stress and distribution caused by the wafer thinning process. This data will be important to guide future 3-D TSV process development to enhance survivability of the ultra-thin wafers during wafer thinning, handling and further processing. To the best of the authors' knowledge, this is the first report of an in-depth stress profile study on ultra-thin wafers.
Copyright A*STAR Institute of Microelectronics 2019