Semiconductor Processing: Stress Management

IME researchers have designed, fabricated and calibrated piezoresistive stress sensors to measure the amount of mechanical stress and distribution caused by the wafer thinning process. This data will be important to guide future 3-D TSV process development to enhance survivability of the ultra-thin wafers during wafer thinning, handling and further processing. To the best of the authors' knowledge, this is the first report of an in-depth stress profile study on ultra-thin wafers.

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