News Releases

Advanced Packaging

A*STAR's Institute of Microelectronics (IME) has established a development line to accelerate the development of fan-out wafer level packaging (FOWLP) capabilities for next-generation Internet of Things (IoT) technologies. The FOWLP development line, which is built upon existing infrastructure at IME's facilities at Singapore Science Park II, and its new facilities at Fusionopolis Two, will allow IME and its partners to develop technologies that serve a wide range of markets such as that of consumer electronics, healthcare and automotive. more

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Research Highlights

Advanced Optics

IME's researchers demonstrated color display metasurface on a 12-inch silicon wafer with critical dimension (CD) below 100 nm by complementary metal-oxide semiconductor (CMOS) compatible technology. This achievement is reported for the first time by IME's Advanced Optics Program (AOP) team, and was published by Optics Express. The paper was selected as Editor's Pick, which recognised work of excellence scientific quality and representative of the work in its research field. more

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