A*STAR @ Semicon SEA

• 22 May, 10.00am - 5pm

The convergence of digital health, AI, digital therapeutics, advanced sensors, wearable technology, robotics, and data analytics is revolutionizing patient care, diagnostics, and treatment. These cutting-edge innovations are enhancing healthcare efficiency, accessibility, and outcomes.

This forum will explore collaborative opportunities in MedTech, not only to drive innovation but also to address industry pain points and challenges collectively. By bringing together experts, thought leaders, and stakeholders, it provides a platform to exchange knowledge, develop solutions, and inspire breakthroughs that will shape the future of healthcare.

• 21 May, 10.00am - 5.00pm

Explore the cutting-edge advancements transforming the semiconductor industry at the Advanced Packaging and Heterogeneous Integration Summit. This event focuses on innovative packaging solutions for chiplet integration and the expanding opportunities in silicon photonics.

Bringing together speakers from across the value chain—materials, equipment, design, packaging, and end-users—it offers a holistic view of the innovations driving performance, power efficiency, and scalability. Key topics include advanced packaging architectures, heterogeneous integration strategies, advanced packaging techniques like fan-out panel-level packaging (FOPLP) and Co-Packaged Optics (CPO) in emerging application such as silicon photonics for data centers and telecommunications.

Engage in thought-provoking discussions, gain valuable insights into industry challenges and solutions, and connect with key players shaping the future of semiconductor technologies. Join us at the summit to discover how advanced packaging and heterogeneous integration are unlocking the potential of tomorrow's innovations.

• 21 May, 10.00am - 5.00pm

The adoption of AI-driven solutions in manufacturing has been a key focus for semiconductor companies. With AI-powered automation, predictive analytics, and machine learning, these processes are evolving beyond efficiency gains to set industry benchmarks. AI-enabled smart manufacturing is now extending beyond the factory floor, transforming facilities into fully integrated AI-powered enterprises. With advanced computing and analytics, organizations can anticipate market shifts, optimize decision-making in real time, and autonomously adapt to changing business landscapes.

This forum will explore how AI enhances productivity, innovation, and scalability; whether predicting customer preferences, optimizing supply chains, enhancing R&D, or enabling real-time production adjustments, reshaping how businesses evolve, compete and grow.

• 21 May, 10.00am - 5.00pm

“Unlocking New Potential in Advanced Package Design with AI enabled design enablement” by Dr Dutta Rahul, Principal Research Engineer, A*STAR Institute of Microelectronics (A*STAR IME).

“Revolutionizing Chip Design: AI for Smarter Architectures and Optimal Component Placement” by Dr Ashish James, Senior Scientist, A*STAR Institute for Infocomm Research.

• 20 May, 1.30pm - 5.00pm

This forum explores the transformative role of AI in the semiconductor industry, both as a driver of innovation and as a tool for enhancing HR productivity. We will examine how AI is being adopted within HR to optimize processes across the full spectrum of work. Beyond technology, the forum emphasizes the critical synergy between HR teams and business leaders in cultivating human assets, driving growth, and achieving business outcomes. Join us for engaging discussions, including insights from business leaders on shaping the Workplace in 2030.

• Prof Lim Yeow Kheng, Assistant Dean, Research and Technology, College of Design and Engineering, National University of Singapore

• Mr Vempati Srinivasa Rao, Director, Heterogeneous Integration, A*STAR Institute of Microelectronics (A*STAR IME)

• Asst Prof Brian Sia, School of Electrical & Electronic Engineering, Nanyang Technological University

• Prof Ang Kah Wee, Chief Technology Officer, National Semiconductor Translational Innovation Centre (NSTIC)

• Dr Zhu Yao, Head of Department, Micro Electro Multiphysical Systems (MEMS), A*STAR Institute of Microelectronics (A*STAR IME)

• Prof Ng Geok Ing, Executive Director, National GaN Technological Centre (NGTC), National Technological University (NTU)