This workshop is designed to present the trends in improving processes and productivity of surface finishing for advanced materials, including results of evaluation of grinding and polishing of glass and silicon wafers. The need for productivity improvements and the transfer of improved processes to local companies will be discussed. Materials such as glasses, quartz, sapphire, silicon and compound semiconductors need to be prepared to a high quality surface finish for precision engineering applications in optics, semiconductors, displays and disk drives. Characteristics such as roughness, flatness, extent of sub-surface damage and cleanliness need to be tightly controlled to high specifications. Typically abrasive finishing techniques are applied to parts, involving the steps of shaping, fine grinding or lapping and polishing. Abrasive finishing processes may involve the use of loose slurries for polishing which can result in low productivity, long polishing times, high consumption and limited re-use of chemicals, high energy use, issues with cleaning and generation of chemical wastes for disposal.
2.00 pm Grinding and Polishing of Advanced Materials by Associate Professor Zhong Zhaowei, NTU, School of MAE
2.40 pm Ultra-precision Grinding and CMP of Hard-brittle Materials by Dr Tian Yebing, SIMTech
3.20 pm Questions and Answers
3.30 pm Roundtable Discussion
4.00 pm Refreshments & Networking
About the Speakers
Associate Professor Zhong Zhaowei received his Doctorate degree in Engineering from Tohoku University, Japan. He worked at the Institute of Physical and Chemical Research (RIKEN), Japan from 1989 to 1992. From 1992 to 1999, he was employed as a Research Fellow and subsequently promoted to Senior Research Fellow at the Gintic Institute of Manufacturing Technology (now known as the Singapore Institute of Manufacturing Technology, a research institute under A*STAR. He is currently an Associate Professor with the School of Mechanical and Aerospace Engineering, Nanyang Technological University. His research interests include mechatronics and design, microelectronics packaging and microsystems, precision engineering and nanotechnology, modeling and analyses, etc.
Dr Tian Yebing obtained his doctorate degree in mechanical manufacturing and automation from Dalian University of Technology in 2007. From 2007 to 2010, he worked in Venture Business Laboratory at Ibaraki University, Japan. He joined Singapore Institute of Manufacturing Technology (SIMTech) since 2010. Currently he is a scientist with the Machine Technology Group. His research focuses on ductile regime grinding of hard and brittle materials, high speed grinding of ultra-ductile materials, chemical mechanical polishing (CMP) of optical silicon substrates and glass hard disk substrates, and drag finishing of complex-shaped components. He published 30 conference and journal papers and held 2 patents on ultra-precision grinding technology.
Who Should Attend
Senior Management (Managing Directors, Chief Executive Officers, General Managers) and Production/Operations Managers, Materials Managers, Business Managers and Senior Engineers.
This is a non-chargeable workshop. Seats are available on a first-come, first served basis. To reserve a place, please register online.
For enquiries on workshop content: Mr Peter Collier, Email: peterc@SIMTech.a-star.edu.sg
For general enquiries: Ms Alice Koh, Email: kohth@SCEI.a-star.edu.sg