Technology Lecture on Applications of Modelling and Optimisation

Date: 08 Feb 2010 - 08 Feb 2010

Venue: Auditorium, SIMTech, Level 3, Tower Block


This seminar will stress the coupling of modelling and optimisation for product design, development, manufacturability, performance, and reliability. 


Topics to include:

a) How much optimisation is desired and/or required?

b) Achieving "Smaller, faster, cheaper" through modelling

c) Several examples of successful combinations of modelling and optimisation


9.00 am Registration
9.15 am Presentation by Mr Steve Groothuis
11.00 am End



About Mr Steve Groothuis

Steven Groothuis leads SimuTech’s new business development and consulting opportunities in the electronics, industrial processing, and alternate energy markets. He has consulted with companies ranging from 10-person start-up groups to well-established, large Fortune 500 companies. He has been involved in engineering simulation projects spanning from MEMS (micro-electromechanical systems), nanoscaled, multiphysical simulations, to predicting large solar panel layer delamination and simulating large power plant piping system vibrational under operating and seismic conditions.


Steve has proposed and completed large engineering simulation projects with clients that require complex Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) simulation for more comprehensive engineering solutions. The physics and mechanics that he is well-versed in are: structural statics and dynamics, fluids, acoustics, electromagnetics, heat and mass transfer, and coupled physics-mechanics like piezoelectrics and thermoelectric. He has also been involved in intellectual property and patent litigation cases by providing highly technical engineering support data.


Prior to joining SimuTech, Steve spent eight years working for Micron Technology in increasing roles of responsibility (Senior Packaging Engineer to Device Physics Group Manager). Steve has also worked for ANSYS as Multiphysics Industry Specialist to build up a MEMS-focused marketing/development initiative and as a Strategic Account Manager. Steve was responsible for large accounts like Intel, General Electric, Motorola, and many more. Prior to ANSYS, Steve spent 14 years at Texas Instruments from a Packaging Technologist to the Advanced Packaging Lab Manager in Dallas. He was involved in several joint venture projects by providing technical simulation support, materials characterisation, and physics of failure studies.

Steve has been an Adjunct Professor at Southern Methodist University, instructing graduate students on numerical techniques for advanced manufacturing process simulations (e.g. friction stir welding, water jet cutting, etc.). He continues to be a Technical Instructor for Semitracks in IC Packaging, MEMS Technology and MEMS Packaging short courses in US, Europe and Asia-Pacific. Steve was one of the first engineers to apply Finite Element Analysis (FEA) to semiconductor packaging & assembly. He was awarded the Semiconductor Research Corporation’s 1995 Outstanding Industrial Mentor Award in Packaging Sciences for Ohio State University research in polymer fracture mechanics.

Steve attained a Masters degree in Physics from The University of Texas and a Bachelors degree in Physics from Michigan State University. He has coauthored over 30 technical, peer-reviewed articles and 6 patents in the areas of process development, simulation meshing, and semiconductor package design. 


Who Should Attend
Scientist, engineers, R&D managers, researchers and academia, and industry professionals from the electronics, precision and transport engineering clusters.

This is a non-chargeable seminar. To book a seat, please register online.

For technical enquiries, please contact Dr Li Wei . Email :
For registration enquiries, please contact Ms Samantha Chan. Email