This seminar has been specially designed for participants to understand the trends and applications in large format manufacturing initiatives.
Abstracts & Speakers
(1) The Application of Flexography for the Volume Printing of Electronics
Flexography is an additive printing process that has the potential to achieve the necessary resolution and precision for volume printing of plastic electronics and OLED lighting. The United Kingdom Technology Strategy Board (TSB) funded the “Accuflex” project, this project is developing a flexographic printing system for volume production of high resolution plastic electronics, achieving fine line registration within large areas on continuous webs. This will require improved control of the printing process, particularly the plate (image carrier) technology; web handling and drying to create accurate fine line and precise features with the requisite inter layer registration that is essential for the use of these processes for the manufacture of sophisticated flexible displays, RFID, intelligent packaging, bio sensors, disposable electronics and intelligent textiles. The initial target products for Accuflex are large area lighting, bio-sensors and conducting tracks for packaging, e.g. on tablet or blister packs.
Key areas to be addressed include:
- Ink rheology and formulation.
- Press development include precision digital drive system.
- On line inter unit registration measurement and full web inspection
- On line laser trimming
- Flexo plate technology
- Substrate technology, including biodegradable films
- Fundamental research in flexography, particularly on contoured and textured plates to address the demands of
feature resolution and quality.
Mr Leslie D Embury is currently the Managing Director of the Gwent Group, a group of companies including Gwent Electronic Materials Ltd, Applied Enzyme Technology Ltd, Gwent Sensors Ltd, Gwent Biotechnology Systems Ltd. and LRH Ltd. A graduate in Applied Chemistry, he is affiliated to the Royal Society of Chemistry, the Institute of Materials, the Ceramics Society and the American Ceramics Society. He had spent some years working on polymer chemistry and precious metal precipitation chemistry at Johnson Matthey Plc. He moved on to work in the fields of precious metal pastes and inks for electro ceramics at Engelhard Industries before founding with partners Gwent Electronic Materials Ltd, a private company owned by the directors in the 1980’s.
(2) Large Area Inkjet Printing
The manufacturing technology of electronics today is in the process of paradigm shift from high cost photolithography and vacuum process to a cost effective, high speed printing and atmospheric process. Inkjet printing technology is currently developed for LCD, PDP, solar cell, E-paper, micro lens, bio etc. Dr Kim will share the current issues and trends of the inkjet technology for printed electronics. The challenges and issues in application of inkjet technology for solar cell manufacturing will be discussed. The various applications developed by UniJet inkjet technology with the customers would be introduced including Roll to Roll printer.
Dr Seog Soon Kim is the President of Unijet Co Ltd. Dr Kim holds a doctorate in Mechanical Engineering from Drexel University and a Masters Degree in Mechanical Engineering from Villanova University. He spent some years with LG Electronics Production Engineering Lab, Samsung Techwin, Precision Machinery Laboratory and was Head of Laboratory, Meccatechs prior to founding Unijet. He serves in the advisory board of the International Conference on Flexible and Printed Electronics (ICFPE).
(3) Web Handling and Tension Control in Roll-to-Roll manufacturing
This session provides an insight into the challenges and issues on web handling and tension control in large format Roll-to-Roll manufacturing.
Mr Thomas Kolbusch is a board member of Organic Electronics Association (OE-A) since June 2009. The Organic Electronics Association is a working group within VDMA, representing the whole process chain in organic electronics like e.g. plastic chips, organic displays, sensors and photovoltaics. He is also Vice President of Coatema Coating Machinery GmbH, an equipment manufacturing company for coating and printing solutions. Currently he is Managing Director of Solarcoating Machinery GmbH, a company supplying equipment for 3rd generation PV, like polymer solar cells located in Dormagen, Germany. He is very active in the field of flexible electronics, photovoltaics, batteries and fuel cells and worked for three years in the board of directors of the KIBZ, a fuel cell network in Baden Württemberg. In North Rhine-Westphalia, he is engaged in a working group on Stack Design for fuel cells.
A graduate from Niederrhein University of Applied Sciences, Thomas worked numerous years for 3M, Germany and alpi GmbH. He is actively involved as an organiser of the Coatema Coating Symposium, an international coating and printing seminar which takes place in Dormagen. He is responsible for several BMBF-funded R&D projects and EU projects on photovoltaics and flexible electronics.
(4) Design for reliability and issues associated with Large Area Processing of Functional Materials
Design for X (DfX; X=Manufacturability, Packaging, Test, Reliability, etc) methodologies and associated software tools play a very important part in Microsystems product design and development. This presentation will discuss the latest trends and developments in Microsystems Packaging and the DfX tools required to support these developments and in particular for the reliability of products developed using large area processing of functional materials. The use of Multi-Physics and Reliability modelling tools for different packaging components will be demonstrated.
Professor Chris Bailey is an academic staff of Computational Mechanics and Reliability at the University of Greenwich in London, United Kingdom. Prior to joining the University of Greenwich in 1991, he did a 3-year post-doctoral fellowship at Carnegie-Mellon University. Chris holds a PhD in Computational Modeling, and an MBA in Technology Management. He has published over 200 papers on Design and Simulation of micro/nano-technology based processes and products and has managed many UK and International projects and worked closely with over 100 companies with regards thier design, simulation and modelling requirements.
Chris is a member of the NAFEMS Multi-Physics Modelling working group, a senior member of the board of governors of IEEE-CPMT, and a UK Committee member of IMAPS. In 2003 he was the Royal Society visiting Professor to Hong Kong. In 2007 he was and Programme Chair for High Density Packaging Conference in Shanghai, China, and also the local organiser of the IEEE sponsored EuroSime conference in London. In 2008 he was the General Chair for the Electronics System-integration Technology Conference (ESTC-2008) in Greenwich, London.
1.30pm "The Application of Flexography for the Volume Printing of Electronics" by Mr Leslie D Embury,
Managing Director Gwent Electronic Materials
2.15pm "Large Area Inkjet Printing" by Dr Seog-Soon Kim, President, Unijet Co
3.00pm "Web Handling and Tension Control in Roll-to-Roll Manufacturing" by Mr Thomas Kolbusch, Vice
President of Coatema Machinery
3.45pm "Design for Reliability and Issues Associated with Large Area Processing of Functional Materials" by
Prof Chris Bailey, University of Greenwich
4.30pm End of Programme
Who Should Attend
Research academic staff, students, senior management, R&D managers and engineers.
Registration for this seminar is free of charge. Seats are confirmed on first-come, first-served basis.
For technical enquiries: Mr Lok Boon Keng, Tel: 6793 8998, Email: bklok@SIMTech.a-star.edu.sg
For general enquiries: Alice Koh, Tel: 6793 8249, Email: email@example.com