FA (Failure Analysis) Techniques for Semiconductor Devices

Date: 13 Sep 2007 - 14 Sep 2007

Venue: Training Room, Level 3, SIMTech Tower Block

The workshop will give an overview of failure analysis (FA) of semiconductor devices from basics to advanced FA technologies. FA of semiconductor devices is always of great concern to the semiconductor manufacturers, particularly when the critical dimension has been reduced below 32nm. The development of SNOM (Scanning Near-field Optical Microscopy) technology has provided a promising inspection means for locating and analysing the failures in a very fine resolution that has overcome the traditional limit. The technology is very useful to applications where nano-scale optical resolution is required. This workshop will provide participants with the domain knowledge that is useful to further develop the SNOM technology and will be of interest to both the industry and research community in the area of semiconductor manufacturing.

Professor Ludwig Josef Balk, Wuppertal University of Germany & Visiting SIMTech Fellow

Who Should Attend
FA engineers, production managers, and semiconductor device designers, researchers, and managers involved in modelling and design of semiconductor devices and VLSI, optical microscopy design and manufacturing, material characterisation, bio-imaging, etc.

Admission is free. Pre-registration for the workshop is necessary.