Technology Lecture on Precision Packaging of Multi-kilowatt Diode Arrays

Date: 13 Apr 2007 - 13 Apr 2007

Venue: Auditorium, Level 3, SIMTech Tower Block

Packaging of diode bars requires precision and reproducibility for efficient high power pumping of lasers. Bar selection and cooling ensure a narrow spectra width for optimal pumping efficiency. This presentation examines the different packaging techniques used for large arrays consisting of hundreds of bars and the cooling methods used. Performance and problems encountered with conventional packaging techniques are examined. The SiMMtec packaging technique that uses silicon monolithic microchannel (SiMM) cooling suitable for mass production with precision and reproducibility is presented. Performance and cooling characteristics of SiMMtec arrays are examined and developments in diode bar characteristics are discussed.

About the Speaker
Dr Keng H Leong is the Chief Technical Office at SiMMtec, a manufacturer of high power diode arrays for pumping solid state lasers. He is the contributing editor for technology at Industrial Laser Solutions besides consulting for Argonne National Laboratory.

Dr Leong holds a PhD and a master's degree in physics and atmospheric sciences. He gave lectures on air pollution control at the University of Illinois at Urbana-Champaign and spent his early career in the aerosol research field before starting a high power laser applications facility at Argonne National Laboratory in 1990. Since then, he has worked in the field of laser processing and technology collaborating with industrial partners. He spent a few years as a senior scientist at Pennsylvania State Applied Research Lab and later at Pennsylvania State Electro-Optics Center before starting SiMMtec.

Who Should Attend
Industry professionals, managers, engineers, researchers, academic staff and students

This lecture is free of charge. Pre-registration for the lecture is necessary. Seats are available on a first-come, first-served basis.