Lead-free Reliability for Harsh Environment Electronics

Date: 23 Mar 2007 - 23 Mar 2007

Venue: Magnolia 4, Grand Hyatt, 10-12 Scotts Road

This seminar will emphasize provocative questions and answers regarding lead-free reliability. The issue on whether the lead-free is reliable enough for harsh environment electronics will be rationalised by addressing * 20 key questions.

Based on the sustained development effort, testing data and manifold evaluations, this seminar dissects what it takes to perform in a harsh environment and the rationale behind it. The question on whether a life-prediction model can assure reliability will be discussed. A relative reliability ranking among viable systems, as well as the scientific, engineering and manufacturing reasons behind the ranking will be outlined. The scientific rationale that SAC (Sn-Ag-Cu) is expected to deliver inferior performance to SnPb under certain sets of conditions, which solder alloys are expected to perform for harsh environment and the material science behind it will be presented.

Who Should Attend
The seminar provides a higher level of working knowledge to all who are involved in the reliability of Pb-free packaging and assembling activities. Attendees who are interested in the broad-based information, as well as the reasons behind the performance and the test data vs. performance should not miss this seminar. Attendees are encouraged to bring their own selected systems for deliberation.

This is non-chargeable seminar. Seats are limited and will be confirmed on a first-come first-served basis.