Lead-Free Flip Chip WLP (Wafer Level Packaging) and MEMS (Micro-ElectroMechanical System) Packaging

Date: 30 Nov 2005 - 30 Nov 2005

Venue: SIMTech Valley Block, Seminar Room, Level 1

Course content (by Dr John Lau from Agilent Technologies Inc)

• Understand EU RoHS and China RoHS
• Implementation of your products in according to the EU RoHS and China RoHS
• Understand all important aspects and critical issues of lead-free soldering
• Have a head-start of Flip Chip WLP for your green products
• Understand all important aspects of Flip Chip WLCSP
• Understand the trends of MEMS
• Understand key MEMS enabling technologies
• Know how to apply WLP to MEMS
• Understand the critical issues and opportunities of MEMS packaging

Most materials are based on the instructor’s recently published technical papers and textbooks, “Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies”, “Electronics Packaging”, “Chip Scale Packages”, “Low-Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies”, “Microvias for Low-Cost High-Density Interconnects”, and “Electronics Manufacturing with Lead-Free Materials”. Each participant will receive a comprehensive set of handout handbook.

Course content (by Dr Wei Jun from SIMTech)

• Novel lead-free solder materials and applications
• Low temperature wafer bonding techniques
• Wafer-level MEMS Packaging