Events

Short Course on Design, Materials, Process and Reliability of Lead-Free Packaging And Assembly

Date: 17 Mar 2005 - 17 Mar 2005

Venue: SIMTech, Seminar Room, Valley Block, Level 1

Introduction

Since February 13, 2003, lead-free legislation has been introduced in the EU (European Union). Effective July 1, 2006, the EU will ban lead in electrical and electronic applications. Products with lead (unless with exemptions) cannot be made in and shipped to countries in the EU. At the same time, China is considering to have her own lead-free law. Recently, packages such as PBGA (plastic ball grid array), CSP (chip scale package), and especially WLCSP (wafer level chip scale package) have been very popular for consumer, computer, communication, and mobile products. Most of these packages use solders as their interconnects, thus they are affected by the lead-free regulations!

In this course, some critical issues in lead-free soldering (such as cost, regulations, definitions, design, materials, forward- and backward-process incompatibility, inspections, tests, and reliability of components, PCBs, tin whiskers, and solder joints) will be presented. Critical issues of the most popular SMT packages such as PBGA, CSP, and WLCSP will be discussed. The impacts of lead-free on these SMT packages are examined. Each participant will also receive a comprehensive set of handout notes.

Who Should Attend

The course is recommended for component, packaging, design, material, process, equipment, reliability, product assurance, quality control, manufacturing, vendor, marketing, and sales engineers and managers. It is equally suited for R&D engineers and scientists.