Advanced Materials and Processing for Integral Capacitors (2004)
Date: 09 Dec 2004 - 09 Dec 2004
Venue: Auditorium, Tower Block, SIMTech, 71 Nanyang Drive
Insatiable demand for miniaturisation and environmental friendly materials in next-generation products is driving the need for advanced low-cost and scalable electronics manufacturing processes. Integrated electronics offers promising solutions to meet future challenges of scalability, flexibility, low power consumption, and reduced cost. A significant step towards realizing integrated electronics is the development of integral or embedded capacitors. Epoxy/BaTiO3 composite embedded capacitor films (ECFs) have been developed to achieve high dielectric constant and robust manufacturing. ECFs are typically composed of specially formulated epoxy resin and latent curing agent, and in terms of coating process, a roller coating method is used for large area implementation. An alternative material for embedded capacitor fabrication has also been developed in the form of embedded capacitor paste (ECP). In this presentation, material synthesis and processing techniques for realising embedded capacitors will be described, along with characterization methods.
Kyung W. Paik received the B.Sc. degree in Metallurgical Engineering from the Seoul National University in 1979 and the M.Sc. degree from the Korea Advanced Institute of Science and Technology (KAIST), and the Ph.D. degree from the Cornell University in Materials Science and Engineering, in 1981, and 1989, respectively.
From 1982 to 1985, he was with KAIST, Seoul, Korea as a Research Scientist and was responsible for various materials development such as gold bonding wire and non-ferrous alloys. After the Ph.D. degree, he worked at the General Electric Corporate Research and Development from 1989 to 1995, where he was involved with the R & D of materials and processes of GE High Density Interconnect (HDI) multichip module technology and power I/C packaging as a Senior Technical Staff. After he joined the Korea Advanced Institute of Science and Technology (KAIST) in 1995, he has been working at the department of Materials Science and Engineering as Professor. In his Nano-Packaging and Interconnect Laboratory (NPIL) he is currently working in the areas of flip chip bumping & assembly, adhesives flip chip, embedded capacitors, and display packaging technologies. He had visited the Packaging Research Center (PRC) at the Georgia Institute of Technology as a visiting professor during March 1999 to February 2000, and involved in the packaging education and also embedded passives research programs. He is currently commercializing the ACF materials for LCD applications and patented several ACFs for flip chip on organic substrates. He has published more than 80 technical papers in the area of electronic packaging and currently holds 16 US patents and 4 US patents pending.
Professor Paik has been the chairman of Korean IEEE-CPMT chapter since 1995, and also a member of the IMAPS, SEMI, and MRS.