Events

Embedded Passives for High-Speed Interconnection in the Broadband Era

Date: 24 May 2004 - 24 May 2004

Venue: SIMTech, Auditorium, Tower Block, Level 3

Abstract

As we embrace the broadband era with ever increasing speed, functionality and portability requirements, there is a tremendous pressure to meet the growing demand for miniaturisation and high-speed performance. Integral passives are a promising technology critical to enable the drive towards miniaturisation and cost performance. Members of A*STAR Microsystems Packaging Programme [Singapore Institute of Manufacturing Technology (SIMTech), Institute of Materials Research & Engineering (IMRE), Institute of Microelectronics (IME), Institute of High Performance Computing (IHPC)], IPC and MacDermid are jointly organising a seminar on Embedded Passives to share with the industry the market opportunities, process technologies and design challenges.

About the Speakers

Mr Dennis Fritz
Dennis holds a BS degree in Chemical Engineering from Rose Hulman Institute of Technology and an MBA degree in Marketing from the University of Delaware.
He started in the printed circuit industry in 1972 as a technical service representative with duPont’s Riston™ division. Dennis had held other assignments in 19 years at MacDermid, including sales and marketing management in both printed circuit consumables and semiconductor photoresist.
He was editor of Organic Board Fabrication section of the 2002 IPC Roadmap and was a principal contact for MacDermid’s participation in the NIST Embedded Passives Program.
Dennis has been appointed as Independent Technology Consultant exclusively to MacDermid, Inc. - Waterbury, Connecticut since April, 1998. Dennis is MacDermid’s principal representative to the US Institute of Printed Circuits. He heads the Alternate Surface Finishes committee of IPC and is principally involved with market and technology research at MacDermid.

Dr Albert Lu
Dr Albert Lu is a Research Scientist with the Joining Technology Group at Singapore Institute of Manufacturing Technology. He spearheads research and development activities in package design, broadband modelling, signal integrity simulation and high-speed characterization. Since 1999, he has also initiated and was project leader for major industry collaborations on optical networking, high-performance computing and next-generation wireless applications including the High Density Substrate Consortium, Broadband Consortium, and Integrated Passives Consortium. Dr Lu is a Member of the IEEE CPMT and MTT Societies, and was invited speaker for IPC Asia PCB Conference 2002, Cadence High Speed Design Seminar 2002 and 2003, and is an Advisory Board Member for Globaltronics 2004.

Mr Ho Voon Yee
Voon Yee is an Advanced Applications Engineer for 3M Asia Pacific, based in Singapore. He works for the Electronics Solutions Division and has applications responsibility for 3M Embedded Capacitance Material, Microinterconnect Flex Circuits and Multilayer packaging products. Voon Yee obtained his Bachelor's degree in Electrical Engineering from the National University of Singapore. He has published 4 papers and articles on signal integrity and flexible circuit packaging.

Please register by 20 May 2004, Thursday with your name, designation, company name, contact no. & email address.